Refractory components for a semiconductor processing chamber

Patent metadata

Field	Value
Publication number	US-2025372351-A1
Application number	US-202319120431-A
Country	US
Kind code	A1
Filing date	Oct 9, 2023
Priority date	Oct 31, 2022
Publication date	Dec 4, 2025
Grant date	—

Abstract

A component for use in a semiconductor processing chamber is provided. A component body has a process facing surface, wherein the component body comprises at least one of iron, iron alloy, nickel, nickel alloy, titanium, and titanium alloy. A coating is over the process facing surface, wherein the coating comprises at least one of a metal oxide, a metal fluoride, and a metal oxyfluoride, wherein the coating is at least 99% by weight pure and has a porosity of less than 0.1%.

First claim

What is claimed is:

1 . A component for use in a semiconductor processing chamber, comprising:
a component body with a process facing surface, wherein the component body comprises at least one of iron, iron alloy, nickel, nickel alloy, titanium, and titanium alloy; and a coating over the process facing surface, wherein the coating comprises at least one of a metal oxide, a metal fluoride, and a metal oxyfluoride, wherein the coating is at least 99% by weight pure and has a porosity of less than 0.1%.

2 . The component, as recited in claim 1 , wherein the coating has a thickness in a range of 50 nm to 6000 nm.

3 . The component, as recited in claim 1 , wherein the coating is in direct contact with the process facing surface of the component body.

4 . The component, as recited in claim 1 , further comprising an aluminum layer between the process facing surface of the component body and the coating.

5 . The component, as recited in claim 1 , further comprising a thermal uniformity cladding over a surface of the component body that is not a process facing surface.

6 . The component, as recited in claim 5 , wherein the thermal uniformity cladding comprises aluminum.

7 . The component, as recited in claim 5 , further comprising a temperature control system for controlling a temperature of the thermal uniformity cladding.

8 . The component, as recited in claim 1 , wherein the component body comprises a stainless steel that is resistant to corrosion from halogen containing plasma.

9 . The component, as recited in claim 1 , wherein the component body comprises at least one of Ti-6A1-4V, NSA, SAE 316L grade stainless steel, and AL-6XN stainless steel.

10 . The component, as recited in claim 1 , wherein the coating comprises at least one of yttria, yttrium trifluoride, hafnium oxide, yttrium aluminum oxide, lanthanide oxide, and lanthanide fluoride.

11 . The component, as recited in claim 1 , wherein the component body comprises stainless steel.

12 . The component, as recited in claim 1 , wherein the component body comprises a titanium alloy.

13 . A method for making a component for use in a semiconductor processing chamber, comprising:
providing a component body comprising at least one of iron, iron alloy, nickel, nickel alloy, titanium, and titanium alloy with a process facing surface; and providing an atomic layer deposition coating over the process facing surface of the component body, wherein the atomic layer deposition coating comprises at least one of a metal oxide, a metal fluoride, and a metal oxyfluoride.

14 . The method, as recited in claim 13 , further comprising depositing an aluminum layer over the process facing surface of the component body before providing the atomic layer deposition coating over the process facing surface of the component body.

15 . The method, as recited in claim 14 , wherein the depositing the aluminum layer comprises depositing the aluminum layer by at least one of electroplating and cold spraying on the process facing surface before providing the atomic layer deposition.

16 . The method, as recited in claim 13 , further comprising providing a thermal uniformity cladding over a surface of the component body that is not a process facing surface.

17 . The method, as recited in claim 16 , wherein the thermal uniformity cladding comprises aluminum.

18 . The method, as recited in claim 13 , further comprising providing a temperature control system for controlling a temperature of the component body.

19 . The method, as recited in claim 13 , wherein the component body comprises a stainless steel that is resistant to corrosion from halogen containing plasma.

20 . The method, as recited in claim 13 , wherein the component body comprises at least one of Ti-6A1-4V, NSA, SAE 316L grade stainless steel, and AL-6XN stainless steel.

21 . The method, as recited in claim 13 , wherein the component body comprises stainless steel.

22 . The method, as recited in claim 13 , wherein the component body comprises a titanium alloy.

Assignees

• Lam Res Corp

Inventors

• Wetzel David Joseph
• Pape Eric A
• Xu Lin
• Daugherty John

Classifications

• C23C28/345

  with at least one oxide layer · CPC title

• C23C28/34

  including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates · CPC title

• C23C28/32

  including at least one pure metallic layer · CPC title

• C23C16/405

  of refractory metals or yttrium · CPC title

• C23C16/40

  Oxides · CPC title