Island etched filter passages

US2016346714A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016346714-A1
Application numberUS-201315033000-A
CountryUS
Kind codeA1
Filing dateOct 30, 2013
Priority dateOct 30, 2013
Publication dateDec 1, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method comprises forming etching islands on a substrate and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate. The filter passage has an inlet into the substrate and an outlet from the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method comprising: forming etching islands on a substrate; and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate, the filter passage having an inlet into the substrate and an outlet from the substrate. 2 . The method of claim 1 , wherein the inlet is on a first face of the substrate and the outlet is on a second face of the substrate. 3 . The method of claim 2 , wherein the first face and the second face are parallel. 4 . The method of claim 2 wherein the forming of the etching islands comprises forming first etching islands on the first face and second etching islands on the second face. 5 . The method of claim 4 , wherein the first etching islands on the first face and the second etching islands on the second face concurrently react in response to exposure to the solution to concurrently etch into the substrate from the first face and the second face, respectively. 6 . The method of claim 1 further comprising forming a trench in the substrate to interconnect the first filter passage and the second filter passage. 7 . The method of claim 1 , wherein the inlet is on a first face of the substrate and the outlet is on a second face of the substrate. 8 . The method of claim 1 , wherein the etching islands remain within the substrate along at least one of the first filter passage and the second filter passage. 9 . The method of claim 1 , netting islands comprise first islands of the first metal having a first etching characteristic in the solution and second islands of a second metal having a second etching characteristic in the solution different than the first etching characteristic. 10 . The method of claim 1 further comprising forming an etch controller within the substrate, the etch controller adjusting an etch rate of the etch islands when interacting with the etch islands within the substrate. 11 . The method of claim 10 , wherein the etch controller comprises an etch retardant. 12 . A method comprising: detecting a composition of metal islands etched into a substrate; and identifying a source of the substrate based upon the detected composition. 13 . An apparatus comprising: a substrate; a first filter passage of interconnected pores extending into the substrate; a second filter passage of interconnected pores extending into the substrate, the second filter passage in communication with the first filter passage; metal islands along at least one of the first filter passage and the second filter passage within the substrate. 14 . The apparatus of claim 13 , wherein the first filter passage and the second filter passage extend into the substrate from a first face and a second face of the substrate, respectively 15 . The apparatus of claim 14 further comprising a third filter passage of interconnected pores extending into the substrate from the second face and connected to the first filter passage.

Assignees

Inventors

Classifications

  • B01D69/02Primary

    characterised by their properties · CPC title

  • Making filtering elements not provided for elsewhere · CPC title

  • Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) · CPC title

  • Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks, (B01D35/05 takes precedence; {water pipe system filters E03B3/18, E03B7/07; dirt catchers in sewers E03F; filters or strainers for pipe-lines in general B08B, E03F; object or dirt catching devices in sinks or the like E03C1/26; suction strainers or filters for pumps F04B53/005, F04D29/70}) · CPC title

  • suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

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What does patent US2016346714A1 cover?
A method comprises forming etching islands on a substrate and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate. The filter passage has an inlet into the substrate and an outlet from the substrate.
Who is the assignee on this patent?
Hewlett Packard Development Co Lp
What technology area does this patent fall under?
Primary CPC classification B01D69/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Dec 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).