Method of providing article with electrically-conductive pattern

Patent metadata

Field	Value
Publication number	US-2025040056-A1
Application number	US-202318359077-A
Country	US
Kind code	A1
Filing date	Jul 26, 2023
Priority date	Jul 26, 2023
Publication date	Jan 30, 2025
Grant date	—

Abstract

An article has an electrically-conductive metal-containing pattern and is prepared by: A) providing a metallic pattern on a first substrate; B) applying a darkening agent to the metallic pattern to form a first darkened surface; C) transferring the metallic pattern to a second substrate, leaving an undarkened second surface of the metallic pattern exposed to view; and D) applying a second darkening agent to the undarkened second surface. The first darkened surface formed in B) can have an L* value that is reduced by at least 1 unit compared to an L* value of the metallic pattern provided in A) before application of the darkening agent. Moreover, the second darkened surface formed in D) can have an L* value that is reduced by at least 1 unit compared to an L* value of the undarkened surface of the transferred metallic pattern provided in C).

First claim

1 . A method for providing an article comprising an electrically-conductive metal-containing pattern, the method comprising, in order:
A) providing a metallic pattern on a surface of a first substrate; B) applying a first darkening agent to a first surface of the metallic pattern to form a first darkened surface of the metallic pattern opposite the surface of the first substrate; C) transferring the metallic pattern to a surface of a second substrate so that the first darkened surface is in direct contact with the surface of the second substrate, leaving an undarkened second surface of the metallic pattern exposed to view; and D) applying a second darkening agent to the undarkened second surface of the transferred metallic pattern to form a second darkened surface of the metallic pattern opposite the surface of the second substrate, to provide the electrically-conductive metal-containing pattern on the surface of the second substrate.

2 . The method of claim 1 , wherein the metallic pattern is electrically-conductive.

3 . The method of claim 1 , comprising the A) providing the metallic pattern on the surface of the first substrate by printing a metal-containing catalytic ink on the surface of the first substrate.

4 . The method of claim 1 , wherein the metallic pattern comprises a plurality of features that can be spaced apart or connected, which plurality of features can be the same or different for each metallic pattern.

5 . The method of claim 1 , wherein during the C) transferring under either or both of heat and pressure, the surface of the second substrate adheres more strongly to the first darkened surface of the metallic pattern so that when the first and second substrates are pulled apart, substantially all of the metallic pattern and the first darkened surface remain on the surface of the second substrate instead of on the surface of the first substrate.

6 . The method of claim 1 , wherein the first darkened surface of the metallic pattern formed in B) has an L* value that is reduced by at least 1 unit compared to an L* value of the metallic pattern provided in A) before application of the first darkening agent in B).

7 . The method of claim 1 , wherein the second darkened surface of the transferred metallic pattern formed in D) has an L* value that is reduced by at least 1 unit compared to an L* value of the undarkened surface of the transferred metallic pattern provided in C) before application of the second darkening agent in D).

8 . The method of claim 1 , wherein the first darkened surface of the metallic pattern formed in B) has a C* value that is closer to zero compared to a C* value of the metallic pattern provided in A) before application of the first darkening agent in B).

9 . The method of claim 1 , wherein the second darkened surface of the transferred metallic pattern formed in D) has a C* value that is closer to zero compared to a C* value of the transferred metallic pattern provided in C) before application of the second darkening agent in D).

10 . The method of claim 1 , wherein:
the first darkened surface of the metallic pattern formed in B) has an L* value that is reduced by at least 1 unit compared to an L* value of the metallic pattern provided in A) before application of the first darkening agent in B); the second darkened surface of the transferred metallic pattern formed in D) has an L* value that is reduced by at least 1 unit compared to an L* value of the undarkened surface of the transferred metallic pattern provided in C) before application of the second darkening agent in D); and the L* value of the first darkened surface of the metallic pattern and the L* value of the second darkened surface of the transferred metallic pattern are the same values, ±5 L* units.

11 . The method of claim 1 , wherein:
the first darkened surface of the metallic pattern formed in B) has a C* value that is closer to zero compared to a C* value of the metallic pattern provided in A) before application of the first darkening agent in B); the second darkened surface of the transferred metallic pattern formed in D) has a C* value that is closer to zero compared to a C* value of the transferred metallic pattern provided in C) before application of the second darkening agent in D); and the C* value of the first darkened surface of the metallic pattern and the C* value of the second darkened surface of the transferred metallic pattern are the same values to within ±25%.

12 . The method of claim 10 , wherein:
the first darkened surface of the metallic pattern formed in B) has a C* value that is closer to zero compared to a C* value of the metallic pattern provided in A) before application of the first darkening agent in B); the second darkened surface of the transferred metallic pattern formed in D) has a C* value that is closer to zero compared to a C* value of the transferred metallic pattern provided in C) before application of the second darkening agent in D); and the C* value of the first darkened surface of the metallic pattern and the C* value of the second darkened surface of the transferred metallic pattern are the same values to within ±25%.

13 . The method of claim 1 , wherein the metallic pattern comprises copper, gold, aluminum, silver, or platinum, or a combination of two or more of these metals.

14 . The method of claim 1 , wherein the first and second darkening agents comprise palladium or nickel.

15 . The method of claim 1 , wherein the first substrate is a transparent polymeric film comprising one or more organic polymers, and the second substrate is a transparent polymeric film web comprising the same or different one or more organic polymers.

16 . The method of claim 1 , wherein A) comprises:
providing a pattern of a catalytic ink on the surface of the first substrate; electrolessly plating a metal onto the pattern of the catalytic ink to form the metallic pattern on the surface of the first substrate.

17 . The method of claim 16 , wherein the transfer of the metallic pattern in step C) is carried out while leaving substantially all of the pattern of catalytic ink pattern on the surface of the first substrate.

18 . The method of claim 16 , wherein the pattern of catalytic ink is cured prior to the A-2) electrolessly plating.

19 . The method of claim 16 , wherein substantially all of the pattern of catalytic ink is transferred together with the metallic pattern in C).

20 . The method of claim 16 , wherein the pattern of catalytic ink is provided in A-1) using a flexographic printing process.

Assignees

• Eastman Kodak Co

Inventors

• Farmer Danielle A
• Honan James S
• Spaulding Kevin Edward

Classifications

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• C23C18/38

  Coating with copper · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• H05K3/20

  by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · CPC title

• H05K2203/0779

  characterised by the specific liquids involved · CPC title