Substrates having adhesion promotor layers and related methods
US-12512397-B2 · Dec 30, 2025 · US
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characterised by the specific liquids involved
characterised by the specific liquids involved · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/0779 |
| Official title | characterised by the specific liquids involved |
| Display label | characterised by the specific liquids involved |
| Total patents | 15 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 3 |
| 2020 | 3 |
| 2021 | 1 |
| 2022 | 1 |
| 2024 | 2 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of providing article with electrically-conductive pattern
US-2025040056-A1 · Jan 30, 2025 · US
Etch Chemistry For Metallic Materials
US-2024102174-A1 · Mar 28, 2024 · US
Etch chemistry for metallic materials
US-11873564-B2 · Jan 16, 2024 · US
Method for manufacturing circuit board
US-11294285-B2 · Apr 5, 2022 · US
Integrated electronic waste recycling and recovery system and process of using same
US-2021040581-A1 · Feb 11, 2021 · US
Method for manufacturing circuit board
US-2020236783-A1 · Jul 23, 2020 · US
Method for manufacturing circuit board
US-10653011-B2 · May 12, 2020 · US
Etch Chemistry For Metallic Materials
US-2020102657-A1 · Apr 2, 2020 · US
Wiring substrate and process for producing it
US-10448506-B2 · Oct 15, 2019 · US
Wiring substrate and process for producing it
US-2019141833-A1 · May 9, 2019 · US
Method for manufacturing circuit board
US-2019116676-A1 · Apr 18, 2019 · US
Water-based organic solderability preservative, and electronic board and surface treatment method using the same
US-10149395-B2 · Dec 4, 2018 · US
Water-based organic solderability preservative, and electronic board and surface treatment method using the same
US-2017327702-A1 · Nov 16, 2017 · US
Display device and method for manufacturing the same
US-2015195915-A1 · Jul 9, 2015 · US