Method for III-v/silicon hybrid integration
US-11953728-B2 · Apr 9, 2024 · US
Method for iii-v/silicon hybrid integration
US2024402427A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024402427-A1 |
| Application number | US-202418629756-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 8, 2024 |
| Priority date | Aug 6, 2018 |
| Publication date | Dec 5, 2024 |
| Grant date | — |
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- Title
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Abstract
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A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
First claim
Opening claim text (preview).
1 . A method of transfer printing, comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region. 2 - 64 . (canceled)
Assignees
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Classifications
Vertical transfer of a single workpiece · CPC title
using optical controlling means · CPC title
for alignment · CPC title
Package configurations · CPC title
Marks applied to devices, e.g. for alignment or identification · CPC title
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Frequently asked questions
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- What does patent US2024402427A1 cover?
- A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precurs…
- Who is the assignee on this patent?
- Rockley Photonics Ltd
- What technology area does this patent fall under?
- Primary CPC classification G02B6/13. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Dec 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).