Polishing method and polishing apparatus

Patent metadata

Field	Value
Publication number	US-2024351161-A1
Application number	US-202418634631-A
Country	US
Kind code	A1
Filing date	Apr 12, 2024
Priority date	Apr 20, 2023
Publication date	Oct 24, 2024
Grant date	—

Abstract

A polishing method and a polishing apparatus that can suppress fluid from remaining on an upper surface of a workpiece, and that can apply an appropriate force to the workpiece to polish the workpiece are disclosed. The polishing method includes: pressurizing a first pressure chamber to move fluid present between an upper surface of the workpiece and the first pressure chamber outward; moving the fluid present between the upper surface of the workpiece and a second pressure chamber outward by pressurizing the second pressure chamber to form a second pressure in the second pressure chamber which is lower than a target pressure when a pressure equal to or higher than the target pressure is formed in the first pressure chamber; and polishing the workpiece after causing the fluid to flow out from the workpiece.

First claim

What is claimed is:

1 . A polishing method for a workpiece using a polishing head having a plurality of pressure chambers formed by an elastic membrane, comprising:
pressurizing a first pressure chamber to move fluid present between an upper surface of the workpiece and the first pressure chamber outward, the plurality of pressure chambers including the first pressure chamber; moving the fluid present between the upper surface of the workpiece and a second pressure chamber outward by pressurizing the second pressure chamber to form a second pressure in the second pressure chamber when a first pressure is formed in the first pressure chamber, the first pressure being equal to or higher than a first target pressure, the second pressure being lower than the first target pressure, the plurality of pressure chambers including the second pressure chamber located outwardly of the first pressure chamber; and pressing a lower surface of the workpiece against a polishing surface with the elastic membrane to polish the lower surface of the workpiece after causing the fluid to flow out from the upper surface of the workpiece.

2 . The polishing method according to claim 1 , wherein pressurizing the first pressure chamber comprises pressurizing the first pressure chamber to form a first initial pressure in the first pressure chamber which is lower than the first target pressure, and
pressure in the first pressure chamber is increased from the first initial pressure to the first target pressure after the first initial pressure is formed in the first pressure chamber.

3 . The polishing method according to claim 2 , wherein the operation of increasing the pressure in the first pressure chamber from the first initial pressure to the first target pressure is started at the same time as or before the pressurization of the second pressure chamber is started.

4 . The polishing method according to claim 1 , wherein
pressurizing the first pressure chamber comprises pressurizing the first pressure chamber to form the first target pressure in the first pressure chamber, and pressurizing the second pressure chamber to form the second pressure in the second pressure chamber which is lower than the first target pressure comprises pressurizing the second pressure chamber to form a second target pressure in the second pressure chamber when the first pressure equal to or higher than the first target pressure is formed in the first pressure chamber, the second target pressure being lower than the first target pressure.

5 . The polishing method according to claim 2 , wherein
the plurality of pressure chambers further include a third pressure chamber located outwardly of the second pressure chamber, the second pressure in the second pressure chamber which is lower than the first target pressure comprises a second initial pressure lower than the first target pressure, and the polishing method further comprises:
lowering pressure in the first pressure chamber from the first target pressure while increasing pressure in the second pressure chamber from the second initial pressure to a second target pressure; and
moving the fluid present between the upper surface of the workpiece and the third pressure chamber outward by pressurizing the third pressure chamber to form a third pressure in the third pressure chamber when the second target pressure is formed in the second pressure chamber, the third pressure being lower than the second target pressure.

6 . A polishing apparatus for a workpiece, comprising:
a polishing table configured to support a polishing pad having a polishing surface; a polishing head having a plurality of pressure chambers formed by an elastic membrane, the polishing head being configured to press the workpiece against the polishing surface with the elastic membrane; and a pressure controlling system configured to control pressures in the plurality of pressure chambers, wherein the plurality of pressure chambers include a first pressure chamber, and a second pressure chamber located outwardly of the first pressure chamber, the pressure controlling system is configured to:
pressurize the first pressure chamber to move fluid present between an upper surface of the workpiece and the first pressure chamber outward;
move the fluid present between the upper surface of the workpiece and the second pressure chamber outward by pressurizing the second pressure chamber to form a second pressure in the second pressure chamber when a first pressure is formed in the first pressure chamber, the first pressure being equal to or higher than a first target pressure, the second pressure being lower than the first target pressure; and
pressurize the plurality of pressure chambers to press a lower surface of the workpiece against the polishing surface with the elastic membrane to polish the lower surface of the workpiece after the fluid is caused to flow out from the upper surface of the workpiece.

7 . The polishing apparatus according to claim 6 , wherein
the pressure controlling system is configured to:
pressurize the first pressure chamber to form a first initial pressure in the first pressure chamber which is lower than the first target pressure; and
increase pressure in the first pressure chamber from the first initial pressure to the first target pressure.

8 . The polishing apparatus according to claim 7 , wherein the pressure controlling system is configured to start the operation of increasing the pressure in the first pressure chamber from the first initial pressure to the first target pressure at the same time as or before the pressurization of the second pressure chamber is started.

9 . The polishing apparatus according to claim 6 , wherein
the pressure controlling system is configured to:
pressurize the first pressure chamber to form the first target pressure in the first pressure chamber; and
pressurize the second pressure chamber to form a second target pressure in the second pressure chamber when the first pressure equal to or higher than the first target pressure is formed in the first pressure chamber, the second target pressure being lower than the first target pressure.

10 . The polishing apparatus according to claim 7 , wherein
the plurality of pressure chambers further include a third pressure chamber located outwardly of the second pressure chamber, the second pressure in the second pressure chamber which is lower than the first target pressure comprises a second initial pressure lower than the first target pressure, and the pressure controlling system is configured to:
lower pressure in the first pressure chamber from the first target pressure while increasing pressure in the second pressure chamber from the second initial pressure to a second target pressure; and
move the fluid present between the upper surface of the workpiece and the third pressure chamber outward by pressurizing the third pressure chamber to form a third pressure in the third pressure chamber when the second target pressure is formed in the second pressure chamber, the third pressure being lower than the second target pressure.

Assignees

• Ebara Corp

Inventors

• Owada Tomoko
• Nabeya Osamu

Classifications

• H10P90/123

  by grinding or lapping · CPC title

• B24B7/228

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B55/06

  Dust extraction equipment on grinding or polishing machines (B24B31/12 takes precedence) · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/345

  Feeding, loading or unloading work specially adapted to lapping · CPC title