Information processing device, substrate processing device, and information processing method
US-2024302817-A1 · Sep 12, 2024 · US
Feeding, loading or unloading work specially adapted to lapping
Feeding, loading or unloading work specially adapted to lapping · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B37/345 |
| Official title | {Feeding, loading or unloading work specially adapted to lapping} |
| Display label | Feeding, loading or unloading work specially adapted to lapping |
| Total patents | 274 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 19 |
| 2016 | 22 |
| 2017 | 21 |
| 2018 | 17 |
| 2019 | 20 |
| 2020 | 25 |
| 2021 | 19 |
| 2022 | 32 |
| 2023 | 30 |
| 2024 | 29 |
| 2025 | 34 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Lapping assembly or process utilizing a bar stack extender
US-9849567-B2 · Dec 26, 2017 · US
Double-disc straight groove cylindrical-component surface grinding disc
US-9839987-B2 · Dec 12, 2017 · US
Apparatus and method for operating machinery under uniformly distributed mechanical pressure
US-2017345695-A1 · Nov 30, 2017 · US
Wafer loading apparatus of wafer polishing equipment and method for adjusting wafer loading position
US-2017323814-A1 · Nov 9, 2017 · US
Polishing apparatus and wafer polishing method
US-2017304992-A1 · Oct 26, 2017 · US
Teaching device and teaching method
US-2017285609-A1 · Oct 5, 2017 · US
Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof
US-2017274494-A1 · Sep 28, 2017 · US
Double-disc straight groove cylindrical-component surface grinding disc
US-2017274499-A1 · Sep 28, 2017 · US
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US-2017252894-A1 · Sep 7, 2017 · US
Substrate processing apparatus
US-9737973-B2 · Aug 22, 2017 · US
Workpiece holding apparatus
US-9728442-B2 · Aug 8, 2017 · US
Automatic handling apparatus
US-2017190019-A1 · Jul 6, 2017 · US
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US-9687957-B2 · Jun 27, 2017 · US
Polishing method and apparatus
US-2017157734-A1 · Jun 8, 2017 · US
Polishing method and apparatus
US-9610673-B2 · Apr 4, 2017 · US
Reversing machine and substrate polishing apparatus
US-2017072531-A1 · Mar 16, 2017 · US
Workpiece holding apparatus
US-2017069523-A1 · Mar 9, 2017 · US
Chuck table and substrate processing system including the same
US-2017040202-A1 · Feb 9, 2017 · US
Substrate processing apparatus and method for detecting abnormality of substrate
US-2016315002-A1 · Oct 27, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B37/345?
- CPC B24B37/345 is the Cooperative Patent Classification code for “Feeding, loading or unloading work specially adapted to lapping.”
- How many patents are filed under CPC B24B37/345 (Feeding, loading or unloading work specially adapted to lapping)?
- Our database includes 274 publications tagged with this CPC code.
- Is patent activity under CPC B24B37/345 growing?
- Publication counts under this code: 29 in 2024 vs 34 in 2025 (latest complete years).