Semiconductor processing device with edge purging

Patent metadata

Field	Value
Publication number	US-2024254629-A1
Application number	US-202418631858-A
Country	US
Kind code	A1
Filing date	Apr 10, 2024
Priority date	Dec 28, 2021
Publication date	Aug 1, 2024
Grant date	—

Abstract

A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.

First claim

What is claimed is:

1 . A susceptor assembly comprising:
a heater pedestal; and a cap coupled to the heater pedestal, the cap comprising a body comprising a top surface and a bottom surface, wherein the bottom surface comprises a recess to receive a top portion of the heater pedestal, and wherein the cap comprises one or more holes radially exterior the recess, the one or more holes extending from the top surface to the bottom surface.

2 . The susceptor assembly of claim 1 , wherein the top surface comprises a substrate recess to receive a substrate.

3 . The susceptor assembly of claim 1 , further comprising a seal,
wherein the top surface comprises a seal recess to receive the seal.

4 . The susceptor assembly of claim 3 , wherein the seal comprises metal.

5 . The susceptor assembly of claim 3 , wherein the one or more holes are radially inward the seal recess.

6 . The susceptor assembly of claim 1 , wherein the cap comprises between 12 and 72 holes.

7 . The susceptor assembly of claim 1 , wherein a diameter of each of the one or more holes is not less than 0.5 mm and not greater than 1.5 mm.

8 . The susceptor assembly of claim 1 , wherein the cap further comprises one or more vacuum chuck grooves within the body.

9 . The susceptor assembly of claim 1 , wherein the cap comprises a purge gas channel within the body and extending laterally.

10 . The susceptor assembly of claim 9 , wherein the heater pedestal comprises a purge gas hole.

11 . The susceptor assembly of claim 1 , wherein the cap comprises an inner region and an outer region, wherein a height of the inner region is greater than a height of the outer region.

12 . The susceptor assembly of claim 11 , wherein the one or more holes are located within the outer region.

13 . An assembly comprising:
a heater pedestal; a cap coupled to the heater pedestal, the cap comprising a body comprising a top surface, a bottom surface, an inner region, an outer region, and one or more holes extending from the top surface to the bottom surface in the outer region; a flow control ring; and a seal between the flow control ring and the outer region.

14 . The assembly of claim 13 , wherein the outer region comprises a seal recess to receive a portion of the seal.

15 . The assembly of claim 14 , wherein the one or more holes are radially inward the seal recess.

16 . The assembly of claim 13 , wherein the seal comprises metal.

17 . The assembly of claim 13 , wherein the cap comprises a purge gas channel within the body and extending laterally.

18 . The assembly of claim 17 , wherein the heater pedestal comprises a purge gas hole.

19 . The assembly of claim 13 , wherein a height of the inner region is greater than a height of the outer region.

20 . A reactor system comprising:
a reaction chamber; and a susceptor assembly within the reaction chamber, the susceptor assembly comprising:
a heater pedestal; and
a cap coupled to the heater pedestal, the cap comprising a body comprising a top surface and a bottom surface,
wherein the bottom surface comprises a recess to receive a top portion of the heater pedestal, and
wherein the cap comprises one or more holes radially exterior the recess, the one or more holes extending from the top surface to the bottom surface.

Assignees

• Asm Ip Holding Bv

Inventors

• Kimtee Ankit
• Rane Rohan Vijay
• Terhorst Herbert
• Shero Eric James
• Winkler Jereld Lee
• Schmotzer Michael
• Zhang Shuyang
• Dunn Todd Robert
• Garg Shubham

Classifications

• C23C16/45574

  Nozzles for more than one gas · CPC title

• C23C16/4585

  Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds · CPC title

• C23C16/4408

  by purging residual gases from the reaction chamber or gas lines · CPC title

• C23C16/4586 Primary

  Elements in the interior of the support, e.g. electrodes, heating or cooling devices · CPC title

• C23C16/46

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title