Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device

Patent metadata

Field	Value
Publication number	US-2024191030-A1
Application number	US-202118277577-A
Country	US
Kind code	A1
Filing date	Nov 4, 2021
Priority date	Mar 25, 2021
Publication date	Jun 13, 2024
Grant date	—

Abstract

This resin composition comprises a bismaleimide compound (A) including a constituent unit represented by formula (1) and containing maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of maleimide compounds other than the bismaleimide compound (A), cyanic acid ester compounds, benzoxazine compounds, epoxy resins, carbodiimide compounds, and compounds having an ethylenically unsaturated group, and a photocuring initiator (C). In formula (1), R1 represents a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, R2 represents a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, the R3 moieties each independently represent a hydrogen atom, a linear or branched C1-C16 alkyl group, or a linear or branched C2-C16 alkenyl group, n 1 each independently indicates an integer of 1-4, and n 2 each independently indicates an integer of 1-4.

First claim

1 . A resin composition comprising:
a bismaleimide compound (A) including a constituent unit represented by the following Formula (1) and maleimide groups at both ends of a molecular chain; at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanic acid ester compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group; and a photocuring initiator (C):

(in Formula (1), R 1 indicates a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, R 2 indicates a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, R 3 's each independently indicate a hydrogen atom, a linear or branched C1-C16 alkyl group, or a linear or branched C2-C16 alkenyl group, R 4 's each independently indicate a hydrogen atom, a linear or branched C1-C6 alkyl group, a halogen atom, a hydroxy group or a linear or branched C1-C6 alkoxy group, n 1 's each independently indicate an integer of 1 to 4, and n 2 's each independently indicate an integer of 1 to 4).

2 . The resin composition according to claim 1 ,
wherein the photocuring initiator (C) contains a compound represented by the following Formula (2):

(in Formula (2), R 4 's each independently indicate a substituent or phenyl group represented by the following Formula (3)),

(in Formula (3), -* indicates a bond, and R 5 's each independently indicate a hydrogen atom or a methyl group).

3 . The resin composition according to claim 1 ,
wherein a content of the bismaleimide resin represented by Formula (1) with respect to a total amount of 100 parts by mass of the bismaleimide compound (A), the resin or compound (B) and the photocuring initiator (C) is 5 to 99.4 parts by mass.

4 . The resin composition according to claim 1 , further comprising a filling material.

5 . A cured object comprising the resin composition according to claim 1 .

6 . A resin sheet, comprising:
a support; and a resin layer that is disposed on one surface or both surfaces of the support, wherein the resin layer contains the resin composition according to claim 1 .

7 . The resin sheet according to claim 6 ,
wherein the resin layer has a thickness of 1 to 50 μm.

8 . A prepreg comprising:
a substrate; and the resin composition according to claim 1 that is impregnated into or applied to the substrate.

9 . A metal-clad laminate comprising:
a layer containing at least one selected from the group consisting of a resin sheet and a prepreg; and a metal foil that is provided on one surface or both surfaces of the layer, wherein the layer contains a cured object of the resin composition according to claim 1 , wherein the resin sheet comprises: a support; and a resin layer that is disposed on one surface or both surfaces of the support, wherein the resin layer contains the resin composition, and the resin layer has a thickness of 1 to 50 μm, wherein the prepreg comprises: a substrate; and the resin composition that is impregnated into or applied to the substrate.

10 . A multilayered printed wiring board comprising:
an insulating layer; and a conductor layer that is formed on one surface or both surfaces of the insulating layer, wherein the insulating layer contains the resin composition according to claim 1 .

11 . A sealing material comprising the resin composition according to claim 1 .

12 . A fiber-reinforced composite material comprising the resin composition according to claim 1 and a reinforcing fiber.

13 . An adhesive comprising the resin composition according to claim 1 .

14 . A semiconductor device comprising the resin composition according to claim 1 .

Assignees

• Nippon Kayaku Kk

Inventors

• Yamamoto Kazuyoshi
• MIZUGUCHI Takahumi
• Yoshizawa eri
• Takeda Mao

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/40

  characterised by their materials · CPC title

• C09J179/085

  Unsaturated polyimide precursors · CPC title

• C08G73/128

  the unsaturated precursors containing heterocyclic moieties in the main chain · CPC title

• C08L79/085

  Unsaturated polyimide precursors · CPC title