Thermoset polymers for high temperature applications
US-2023312870-A1 · Oct 5, 2023 · US
the unsaturated precursors containing heterocyclic moieties in the main chain
the unsaturated precursors containing heterocyclic moieties in the main chain · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G73/128 |
| Official title | {the unsaturated precursors containing heterocyclic moieties in the main chain} |
| Display label | the unsaturated precursors containing heterocyclic moieties in the main chain |
| Total patents | 86 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 4 |
| 2017 | 7 |
| 2018 | 9 |
| 2019 | 5 |
| 2020 | 7 |
| 2021 | 15 |
| 2022 | 7 |
| 2023 | 6 |
| 2024 | 14 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Photosensitive resin composition and method for producing cured relief pattern
US-2023221639-A1 · Jul 13, 2023 · US
Photosensitive resin composition and method for producing cured relief pattern
US-11640112-B2 · May 2, 2023 · US
Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film
US-11608438-B2 · Mar 21, 2023 · US
Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product
US-11530324-B2 · Dec 20, 2022 · US
Method for producing aqueous polyimide precursor solution composition
US-11407857-B2 · Aug 9, 2022 · US
Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
US-2022169852-A1 · Jun 2, 2022 · US
Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board
US-2022081514-A1 · Mar 17, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022071025-A1 · Mar 3, 2022 · US
Thermosetting resin composition, film adhesive, prepreg, and production method thereof
US-2022017698-A1 · Jan 20, 2022 · US
Photosensitive resin composition and method for producing cured relief pattern
US-2022011669-A1 · Jan 13, 2022 · US
Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern
US-2021405529-A1 · Dec 30, 2021 · US
Heat-curable maleimide resin composition and adhesive agent, substrate material, primer, coating material and semiconductor device using same
US-2021371594-A1 · Dec 2, 2021 · US
Imide oligomer, varnish, cured products thereof, and prepreg and fiber-reinforced composite material using these
US-2021340327-A1 · Nov 4, 2021 · US
Bismaleimide-based solution for inkjet ink for three dimensional printing
US-11161995-B2 · Nov 2, 2021 · US
Photosensitive resin composition and method for producing cured relief pattern
US-11163234-B2 · Nov 2, 2021 · US
Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed wiring board
US-11118012-B2 · Sep 14, 2021 · US
Liquid crystal display device
US-11112654-B2 · Sep 7, 2021 · US
Biofunctional hydrogel for wound healing
US-2021244846-A1 · Aug 12, 2021 · US
Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern
US-2021165327-A1 · Jun 3, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G73/128?
- CPC C08G73/128 is the Cooperative Patent Classification code for “the unsaturated precursors containing heterocyclic moieties in the main chain.”
- How many patents are filed under CPC C08G73/128 (the unsaturated precursors containing heterocyclic moieties in the main chain)?
- Our database includes 86 publications tagged with this CPC code.
- Is patent activity under CPC C08G73/128 growing?
- Publication counts under this code: 14 in 2024 vs 9 in 2025 (latest complete years).