Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device
US-2024191030-A1 · Jun 13, 2024 · US
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Patent family 83395315
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 83395315 |
| Family type | — |
| Earliest priority | Mar 25, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024191030A1 — Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device |
Representative publication
Best representative member for this family based on priority and filing country.
US2024191030A1 — Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device (published Jun 13, 2024)
Member publications
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