Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board

Patent metadata

Field	Value
Publication number	US-2024182657-A1
Application number	US-202218282929-A
Country	US
Kind code	A1
Filing date	Mar 9, 2022
Priority date	Mar 24, 2021
Publication date	Jun 6, 2024
Grant date	—

Abstract

A resin composition contains a polyphenylene ether compound (A) having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, a curing agent (B), a titanate compound filler (C), and a silica filler (D), in which the content ratio of the titanate compound filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group.

In Formula (2), R 4 represents a hydrogen atom or an alkyl group.

First claim

1 . A resin composition comprising:
a polyphenylene ether compound (A) having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule; a curing agent (B); a titanate compound filler (C); and a silica filler (D), wherein a content ratio of the titanate compound filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio,

[in Formula (1), p represents 0 to 10, Ar represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group],

[in Formula (2), R 4 represents a hydrogen atom or an alkyl group].

2 . The resin composition according to claim 1 , wherein a relative dielectric constant of the titanate compound filler (C) is 50 or more.

3 . The resin composition according to claim 1 , wherein the titanate compound filler (C) includes at least one selected from the group consisting of titanium oxide particles, barium titanate particles, strontium titanate particles, calcium titanate particles, magnesium titanate particles, zinc titanate particles, lanthanum titanate particles, neodymium titanate particles, and aluminum titanate particles.

4 . The resin composition according to claim 1 , wherein the curing agent (B) includes at least one selected from the group consisting of an allyl compound, a methacrylate compound, an acrylate compound, an acenaphthylene compound, a polybutadiene compound, a polyfunctional aromatic vinyl compound, a vinyl hydrocarbon-based compound, and a maleimide compound.

5 . The resin composition according to claim 1 , wherein the titanate compound filler (C) includes at least one of strontium titanate particles and calcium titanate particles.

6 . The resin composition according to claim 1 , wherein the titanate compound filler (C) is subjected to surface treatment with a silane coupling agent or a titanium coupling agent.

7 . The resin composition according to claim 1 , wherein a content of the titanate compound filler (C) is 20 to 300 parts by mass with respect to 100 parts by mass of a sum of the polyphenylene ether compound (A) and the curing agent (B).

8 . The resin composition according to claim 1 , wherein a cured product of the resin composition has a relative dielectric constant of 3.5 to 7 at a frequency of 10 GHz and a dielectric loss tangent of 0.01 or less at a frequency of 10 GHz.

9 . The resin composition according to claim 1 , which is used to form an insulating layer included between wiring layers in a wiring board including 10 or more wiring layers.

10 . A prepreg comprising:
the resin composition according to claim 1 or a semi-cured product of the resin composition; and a fibrous base material.

11 . The prepreg according to claim 10 , wherein
a relative dielectric constant of a cured product of the prepreg is 3.5 to 7 at a frequency of 10 GHz, and a difference between a relative dielectric constant of a cured product of the resin composition at a frequency of 10 GHz and a relative dielectric constant of the fibrous base material at a frequency of 10 GHz is 0 to 0.3.

12 . The prepreg according to claim 10 , wherein a relative dielectric constant of the fibrous base material is 3.5 to 7 at a frequency of 10 GHz.

13 . A film with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and a support film.

14 . A metal foil with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and a metal foil.

15 . A metal-clad laminate comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and a metal foil.

16 . A wiring board comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and wiring.

17 . A metal-clad laminate comprising:
an insulating layer containing a cured product of the prepreg according to claim 10 ; and a metal foil.

18 . A wiring board comprising:
an insulating layer containing a cured product of the prepreg according to claim 10 ; and wiring.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• IRIFUNE Akira
• Nishino Mitsuyoshi

Classifications

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title