Metal-clad laminate, wiring board, resin-including metal foil, and resin composition
US-12447719-B2 · Oct 21, 2025 · US
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IRIFUNE Akira patents
IRIFUNE Akira is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | IRIFUNE Akira |
| Total patents | 8 |
| First publication | Dec 3, 2015 |
| Latest publication | Oct 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
US-2024182614-A1 · Jun 6, 2024 · US
Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
US-2024182657-A1 · Jun 6, 2024 · US
Metal-clad laminate, wiring board, resin-including metal foil, and resin composition
US-2023094806-A1 · Mar 30, 2023 · US
Metal-clad laminate and metal foil with resin
US-11254100-B2 · Feb 22, 2022 · US
Metal-clad laminate, wiring board, metal foil provided with resin, and resin composition
US-2021395452-A1 · Dec 23, 2021 · US
Metal-clad laminate and metal foil with resin
US-2018297329-A1 · Oct 18, 2018 · US
Thermally-conductive, electrically-conductive adhesive composition
US-2015344749-A1 · Dec 3, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Panasonic Ip Man Co Ltd | 7 |
| Kansai University | 1 |
| Tanaka Precious Metal Ind | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B15/08 | 6 |
| B32B2457/08 | 6 |
| H05K1/09 | 5 |
| B32B15/20 | 5 |
| H05K1/0366 | 4 |