Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
US-2024182657-A1 · Jun 6, 2024 · US
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Patent family 83395711
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 83395711 |
| Family type | — |
| Earliest priority | Mar 24, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024182657A1 — Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
Representative publication
Best representative member for this family based on priority and filing country.
US2024182657A1 — Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board (published Jun 6, 2024)
Member publications
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