Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure

Patent metadata

Field	Value
Publication number	US-2023141042-A1
Application number	US-202117911770-A
Country	US
Kind code	A1
Filing date	Mar 3, 2021
Priority date	Mar 17, 2020
Publication date	May 11, 2023
Grant date	—

Abstract

A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

First claim

1 . A flux resin composition comprising an epoxy resin (A), an imidazole compound (B), a thixo agent (C), and an activator (D),
the epoxy resin (A) including at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins, content of the at least one resin being equal to or greater than 20% by weight with respect to a total weight of the epoxy resin (A), a time it takes for a value calculated by
(viscosity of the flux resin composition after storage/viscosity of the flux resin composition at beginning of the storage)×100(%)

to reach 120% since the flux resin composition has started to be stored at 25° C. being equal to or longer than 24 hours,
the flux resin composition allowing a solder ball to have a wet spreadability equal to or greater than 50% before and after a reflow process,
a cured product of the flux resin composition having a glass transition temperature equal to or higher than 85° C.

2 . The flux resin composition of claim 1 , wherein
the imidazole compound (B) has a melting point equal to or higher than 130° C.

3 . The flux resin composition of claim 1 , wherein
the flux resin composition has, at 25° C. and 10 rpm, a viscosity equal to or greater than 35 Pa·s and equal to or less than 280 Pa·s and has, as a ratio of 2.5 rpm/10 rpm, a thixo ratio equal to or greater than 1.5 and equal to or less than 5.5.

4 . The flux resin composition of claim 1 , wherein
with respect to a total of the epoxy resin (A), the imidazole compound (B), the thixo agent (C), and the activator (D), proportion of the epoxy resin (A) is equal to or greater than 70% by weight and equal to or less than 94.7% by weight, proportion of the imidazole compound (B) is equal to or greater than 0.05% by weight and equal to or less than 2.4% by weight, proportion of the thixo agent (C) is equal to or greater than 0.75% by weight and equal to or less than 5.55% by weight, and proportion of the activator (D) is equal to or greater than 4.25% by weight and equal to or less than 23% by weight.

5 . An electronic component comprising:
an electronic component body; a conductor formed on a surface of the electronic component body; a bump of solder disposed on the conductor and electrically connected to the conductor; and a reinforcing portion that is a cured product of the flux resin composition of claim 1 and reinforces a joint between the conductor and the bump.

6 . A method for manufacturing the electronic component of claim 5 , the method comprising
curing the flux resin composition after adhering the flux resin composition onto the joint between the conductor and the bump.

7 . A mounting structure comprising:
a circuit board including a first conductor; an electronic component including a second conductor; a bump of solder interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second conductor to each other; and a reinforcing portion that is a cured product of the flux resin composition of claim 1 and reinforces at least one of a joint between the first conductor and the bump or a joint between the second conductor and the bump.

8 . A method for manufacturing the mounting structure of claim 7 , the method comprising
curing the flux resin composition after adhering the flux resin composition onto at least one of the joint between the first conductor and the bump or the joint between the second conductor and the bump.

9 . The flux resin composition of claim 2 , wherein
the flux resin composition has, at 25° C. and 10 rpm, a viscosity equal to or greater than 35 Pa·s and equal to or less than 280 Pa·s and has, as a ratio of 2.5 rpm/10 rpm, a thixo ratio equal to or greater than 1.5 and equal to or less than 5.5.

10 . The flux resin composition of claim 2 , wherein
with respect to a total of the epoxy resin (A), the imidazole compound (B), the thixo agent (C), and the activator (D), proportion of the epoxy resin (A) is equal to or greater than 70% by weight and equal to or less than 94.7% by weight, proportion of the imidazole compound (B) is equal to or greater than 0.05% by weight and equal to or less than 2.4% by weight, proportion of the thixo agent (C) is equal to or greater than 0.75% by weight and equal to or less than 5.55% by weight, and proportion of the activator (D) is equal to or greater than 4.25% by weight and equal to or less than 23% by weight.

11 . An electronic component comprising:
an electronic component body; a conductor formed on a surface of the electronic component body; a bump of solder disposed on the conductor and electrically connected to the conductor; and a reinforcing portion that is a cured product of the flux resin composition of claim 2 and reinforces a joint between the conductor and the bump.

12 . A method for manufacturing the electronic component of claim 11 , the method comprising
curing the flux resin composition after adhering the flux resin composition onto the joint between the conductor and the bump.

13 . A mounting structure comprising:
a circuit board including a first conductor; an electronic component including a second conductor; a bump of solder interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second conductor to each other; and a reinforcing portion that is a cured product of the flux resin composition of claim 2 and reinforces at least one of a joint between the first conductor and the bump or a joint between the second conductor and the bump.

14 . A method for manufacturing the mounting structure of claim 13 , the method comprising
curing the flux resin composition after adhering the flux resin composition onto at least one of the joint between the first conductor and the bump or the joint between the second conductor and the bump.

15 . The flux resin composition of claim 3 , wherein
with respect to a total of the epoxy resin (A), the imidazole compound (B), the thixo agent (C), and the activator (D), proportion of the epoxy resin (A) is equal to or greater than 70% by weight and equal to or less than 94.7% by weight, proportion of the imidazole compound (B) is equal to or greater than 0.05% by weight and equal to or less than 2.4% by weight, proportion of the thixo agent (C) is equal to or greater than 0.75% by weight and equal to or less than 5.55% by weight, and proportion of the activator (D) is equal to or greater than 4.25% by weight and equal to or less than 23% by weight.

16 . An electronic component comprising:
an electronic component body; a conductor formed on a surface of the electronic component body; a bump of solder disposed on the conductor and electrically connected to the conductor; and a reinforcing portion that is a cured product of the flux resin composition of claim 3 and reinforces a joint between the conductor and the bump.

17 . A method for manufacturing the electronic component of claim 16 , the method comprising
curing the flux resin composition after adhering the flux resin composition onto the joint between the conductor and the bump.

18 . A mounting structure comprising:
a circuit board including a first conductor; an electronic component including a second conductor; a bump of solder interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second c

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• SANADA Shohei
• Yamatsu Shigeru

Classifications

• C08G59/686

  containing nitrogen · CPC title

• C08G59/38

  together with di-epoxy compounds · CPC title

• C08G59/226

  Mixtures of di-epoxy compounds · CPC title

• C08G59/685 Primary

  Carboxylates · CPC title

• C08G59/5073

  having two nitrogen atoms in the ring · CPC title