Method for producing composite material
US-2024052186-A1 · Feb 15, 2024 · US
Silver particles
US2022288678A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022288678-A1 |
| Application number | US-202017638709-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 12, 2020 |
| Priority date | Sep 2, 2019 |
| Publication date | Sep 15, 2022 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present invention provides novel silver particles that when used as a conductive adhesive, are satisfactorily sintered at a low temperature without application of pressure during sintering of the conductive adhesive, and form a sintered body with high denseness and high mechanical strength (shear strength). Silver particles comprising silver particles A with an average particle diameter in the range of 50 to 500 nm, and silver particles B with an average particle diameter in the range of 0.5 to 5.5 μm, wherein the silver particles satisfy a relationship in which the average particle diameter of the silver particles B is 5 to 11 times the average particle diameter of the silver particles A.
First claim
Opening claim text (preview).
1 . Silver particles comprising: silver particles A with an average particle diameter in the range of 50 to 500 nm; and silver particles B with an average particle diameter in the range of 0.5 to 5.5 □m, wherein the silver particles satisfy a relationship in which the average particle diameter of the silver particles B is 5 to 11 times the average particle diameter of the silver particles A. 2 . The silver particles according to claim 1 , wherein the mass ratio of the silver particles A to the silver particles B is in the range of 1:9 to 9:1. 3 . The silver particles according to claim 1 , wherein an amine compound is adhered to a surface of the silver particles A. 4 . The silver particles according to claim 1 , wherein the silver particles comprise silver particles with a particle diameter of less than 50 nm. 5 . A conductive adhesive comprising the silver particles according to claim 1 and a solvent. 6 . A sintered body of the conductive adhesive according to claim 5 . 7 . An electronic part in which members are bonded with the sintered body according to claim 6 . 8 . A method for producing a sintered body, comprising the step of sintering the conductive adhesive according to claim 5 at a temperature of 200° C. or more and 250° C. or less. 9 . A method for producing an electronic part in which members are bonded with a sintered body, comprising the steps of: placing the conductive adhesive according to claim 5 between the members; and sintering the conductive adhesive at a temperature of 200° C. or more and 250° C. or less.
Assignees
Inventors
Classifications
comprising metals or metalloids, e.g. solders · CPC title
Die-attach connectors having a filler embedded in a matrix · CPC title
of bond pads · CPC title
- B22F7/064Primary
using an intermediate powder layer · CPC title
starting from liquid metal compounds, e.g. solutions · CPC title
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- What does patent US2022288678A1 cover?
- The present invention provides novel silver particles that when used as a conductive adhesive, are satisfactorily sintered at a low temperature without application of pressure during sintering of the conductive adhesive, and form a sintered body with high denseness and high mechanical strength (shear strength). Silver particles comprising silver particles A with an average particle diameter in …
- Who is the assignee on this patent?
- Osaka Soda Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B22F7/064. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Sep 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).