Sensor package structure

Patent metadata

Field	Value
Publication number	US-10825851-B2
Application number	US-201916390280-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Oct 11, 2018
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.

First claim

What is claimed is:

1. A sensor package structure, comprising:
a substrate made of a material with a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C.;
a sensor chip disposed on the substrate, wherein a top surface of the sensor chip has a sensing region;
a plurality of metal wires electrically connecting the substrate and the sensor chip;
a glass cover including:
a board body having a light-permeable portion and an annular portion arranged around the light-permeable portion; and
an annular supporting body connected to the annular portion of the board body, wherein the annular supporting body of the glass cover is disposed on the substrate, the glass cover and the substrate jointly surround an enclosed accommodating space, the sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body;

an adhesive layer connecting the annular supporting body to the substrate; and
a package body disposed on the substrate, wherein the package body is arranged around the glass cover and the adhesive layer, and the light-permeable portion of the glass cover is exposed from the package body,
wherein an outer lateral side of the adhesive layer is retracted from an outer lateral side of the annular supporting body by a distance, so that a gap is formed among the outer lateral side of the adhesive layer, the substrate, and a bottom side of the annular supporting body, and wherein the package body is filled within the gap so as to connect the outer lateral side of the adhesive layer, the substrate, and the bottom side of the annular supporting body.

2. The sensor package structure according to claim 1 , wherein an outer lateral side of the annular portion protrudes from the annular supporting body, and at least part of the outer lateral side of the annular portion is covered by the package body.

3. The sensor package structure according to claim 1 , further comprising a surrounding wall disposed on the substrate, wherein the annular supporting body is arranged inside of the surrounding wall, the annular supporting body and the surrounding wall are spaced out a distance so as to form a filling slot, and the filling slot is fully filled with the package body.

4. The sensor package structure according to claim 1 , wherein the substrate has an annular groove, the annular supporting body is disposed in the annular groove, and the adhesive layer is arranged in the annular groove.

5. The sensor package structure according to claim 1 , wherein the glass cover includes a bonding layer that connects the board body and the annular supporting body.

6. A sensor package structure, comprising:
a substrate made of a material with a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C.;
a sensor chip disposed on the substrate, wherein a top surface of the sensor chip has a sensing region;
a plurality of metal wires electrically connecting the substrate and the sensor chip;
a glass cover including:
a board body having a light-permeable portion and an annular portion arranged around the light-permeable portion; and
an annular supporting body connected to the annular portion of the board body, wherein the annular supporting body of the glass cover is disposed on the substrate, the glass cover and the substrate jointly surround an enclosed accommodating space, the sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body;

an adhesive layer connecting the annular supporting body to the substrate;
a package body disposed on the substrate, wherein the package body is arranged around the glass cover and the adhesive layer, and the light-permeable portion of the glass cover is exposed from the package body; and
a surrounding wall disposed on the substrate, wherein the annular supporting body is arranged inside of the surrounding wall, the annular supporting body and the surrounding wall are spaced out a distance so as to form a filling slot, and the filling slot is fully filled with the package body.

7. A sensor package structure, comprising:
a substrate made of a material with a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C.;
a sensor chip disposed on the substrate, wherein a top surface of the sensor chip has a sensing region;
a plurality of metal wires electrically connecting the substrate and the sensor chip;
a glass cover including:
a board body having a light-permeable portion and an annular portion arranged around the light-permeable portion; and
an annular supporting body connected to the annular portion of the board body, wherein the annular supporting body of the glass cover is disposed on the substrate, the glass cover and the substrate jointly surround an enclosed accommodating space, the sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body;

an adhesive layer connecting the annular supporting body to the substrate, wherein the glass cover includes a bonding layer that connects the board body and the annular supporting body; and
a surrounding wall disposed on the substrate, wherein the annular supporting body is arranged inside of and connected to the surrounding wall, an outer lateral side of the annular portion protrudes from the annular supporting body, and the board body is fixed to the annular supporting body and the surrounding wall through the bonding layer.

Assignees

• Kingpak Tech Inc

Inventors

• Yang Sheng
• Hung Li-Chun
• Tu Hsiu-Wen
• Yang Jo-Wei
• Lee Chien-Chen
• Chen Jian-Ru

Classifications

• H10W90/751

  of bond wires · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/331

  Shapes of die-attach connectors · CPC title

• H10W72/50

  Bond wires · CPC title