Carrier for microelectronic assemblies having direct bonding

Patent metadata

Field	Value
Publication number	US-2022199453-A1
Application number	US-202017132372-A
Country	US
Kind code	A1
Filing date	Dec 23, 2020
Priority date	Dec 23, 2020
Publication date	Jun 23, 2022
Grant date	—

Abstract

Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.

First claim

1 . A carrier assembly, comprising:
a carrier; a textured material coupled to the carrier and including texturized microstructures; and a plurality of microelectronic components mechanically and removably coupled to the texturized microstructures.

2 . The carrier assembly of claim 1 , wherein the textured material is a dry adhesive material.

3 . The carrier assembly of claim 2 , wherein a shape of the texturized microstructures of the dry adhesive material includes one or more of a pillar, a capped pillar, a sphere, a dome, a suction cup, and a tilted suction cup.

4 . The carrier assembly of claim 2 , wherein the texturized microstructures are imprinted, molded, lithographically patterned, or laminated on the dry adhesive material.

5 . The carrier assembly of claim 2 , wherein a thickness of the texturized microstructures is between 100 nanometers and 150 microns.

6 . The carrier assembly of claim 1 , wherein the textured material includes an actuatable material that generates the texturized microstructures upon activation.

7 . The carrier assembly of claim 6 , wherein the actuatable material is activated by one or more of ultraviolet radiation, increased temperature, and infrared light.

8 . The carrier assembly of claim 6 , wherein the actuatable material includes an elastomer, a rubber, a urethane, a urethane copolymer, a polyurethane, an acrylate, an acrylate copolymer, a silicone, a silicone copolymer, a perfluoroelastomer, and combinations thereof.

9 . The carrier assembly of claim 1 , wherein a material of the carrier includes glass, silicon, or a semi-conductor material.

10 . The carrier assembly of claim 1 , wherein the microelectronic components are individually removable.

11 . A carrier assembly, comprising:
a carrier; a patterned, textured material coupled to the carrier and including texturized microstructures; and a plurality of microelectronic components mechanically and removably coupled to the texturized microstructures.

12 . The carrier assembly of claim 11 , wherein the textured material is a dry adhesive material.

13 . The carrier assembly of claim 12 , wherein a shape of the texturized microstructures of the dry adhesive material includes one or more of a pillar, a capped pillar, a sphere, a dome, a suction cup, and a tilted suction cup.

14 . The carrier assembly of claim 11 , wherein the textured material includes an actuatable material that generates the texturized microstructures upon activation.

15 . The carrier assembly of claim 14 , wherein the actuatable material is activated by one or more of ultraviolet radiation, increased temperature, and infrared light.

16 . The carrier assembly of claim 14 , wherein the actuatable material includes an elastomer, a rubber, a urethane, a urethane copolymer, a polyurethane, an acrylate, an acrylate copolymer, a silicone, a silicone copolymer, a perfluoroelastomer, and combinations thereof.

17 . A carrier assembly, comprising:
a carrier including a textured material having texturized microstructures; and a plurality of microelectronic components mechanically and removably coupled to the texturized microstructures.

18 . The carrier assembly of claim 11 , wherein a footprint of the texturized microstructures includes a rectangular-shape, a circular-shape, a cross-shape, an oval-shape, a ring-shape, or an octagonal-shape, or any combination thereof.

19 . The carrier assembly of claim 17 , wherein the texturized microstructures are arranged in a grid array, a hexagonal array, or a face-centered cubic array.

20 . The carrier assembly of claim 17 , wherein the microelectronic components are collectively removable.

Assignees

• Intel Corp

Inventors

• Baker Michael J
• Liff Shawna M
• Wang Hsin-Wei
• Lopez Albert S

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7414

  the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/722

  Details of electrostatic chucks · CPC title