Carrier for microelectronic assemblies having direct bonding
US-2022199453-A1 · Jun 23, 2022 · US
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Patent family 78819976
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 78819976 |
| Family type | — |
| Earliest priority | Dec 23, 2020 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2022199453A1 — Carrier for microelectronic assemblies having direct bonding |
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US2022199453A1 — Carrier for microelectronic assemblies having direct bonding (published Jun 23, 2022)
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