Wafer level multi form factor die singulation
US-2026096368-A1 · Apr 2, 2026 · US
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Baker Michael J patents
Baker Michael J is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Baker Michael J |
| Total patents | 23 |
| First publication | Dec 8, 2016 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Handling assembly, handling system and method
US-2025210392-A1 · Jun 26, 2025 · US
Carrier for microelectronic assemblies having direct bonding
US-12142510-B2 · Nov 12, 2024 · US
3d printing of structures inside a patient
US-2024350201-A1 · Oct 24, 2024 · US
3D printing of structures inside a patient
US-12023103-B2 · Jul 2, 2024 · US
Apparatus, system, and method for implanting surgical material
US-11937879-B2 · Mar 26, 2024 · US
3d printing of structures inside a patient
US-2024065762-A1 · Feb 29, 2024 · US
System and method for implanting smart implants using robotic telesurgery
US-11864855-B2 · Jan 9, 2024 · US
System and method for implanting smart implants using robotic telesurgery
US-2023397964-A1 · Dec 14, 2023 · US
Designing and manufacturing prosthetic implants
US-11819416-B1 · Nov 21, 2023 · US
Recent patents
Latest publications not already listed above.
Apparatus, system, and method for implanting surgical material
US-2023329790-A1 · Oct 19, 2023 · US
Apparatus, system, and method for implanting surgical material
US-2023329789-A1 · Oct 19, 2023 · US
Implantable sensor device
US-2023290497-A1 · Sep 14, 2023 · US
System and method for implanting smart implants using robotic telesurgery
US-11478314-B1 · Oct 25, 2022 · US
Carrier for microelectronic assemblies having direct bonding
US-2022199450-A1 · Jun 23, 2022 · US
Carrier for microelectronic assemblies having direct bonding
US-2022199453-A1 · Jun 23, 2022 · US
Carrier for microelectronic assemblies having direct bonding
US-2022199449-A1 · Jun 23, 2022 · US
Stacked die architectures with improved thermal management
US-2021375719-A1 · Dec 2, 2021 · US
Device, system and method for cancer prognosis and uses thereof
US-10801073-B2 · Oct 13, 2020 · US
Space-efficient underfilling techniques for electronic assemblies
US-2018061673-A1 · Mar 1, 2018 · US
Device, system and method for cancer prognosis and uses thereof
US-2017342506-A1 · Nov 30, 2017 · US
Space-efficient underfilling techniques for electronic assemblies
US-9728425-B1 · Aug 8, 2017 · US
Ultraviolet disinfection of medical device access sites
US-2016354503-A1 · Dec 8, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ix Innovation Llc | 11 |
| Intel Corp | 9 |
| Cedars Sinai Medical Center | 2 |
| Univ Oregon Health & Science | 1 |
| Baker Group Llp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.