Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-2021398827-A1
Application number	US-202117467346-A
Country	US
Kind code	A1
Filing date	Sep 6, 2021
Priority date	Dec 13, 2017
Publication date	Dec 23, 2021
Grant date	—

Abstract

A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

First claim

What is claimed is:

1 . A substrate processing apparatus comprising:
a substrate holder including a rotatable first holder configured to suck and hold a first area including a central portion of a lower surface of a substrate, and a second holder configured to suck and hold a second area which is an area other than the first area of the lower surface of the substrate; a first cleaning body configured to clean an upper surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith; a first mover including a first rail configured to horizontally move the first cleaning body; a second cleaning body configured to clean the lower surface of the substrate held by the substrate holder by coming into contact therewith; a second mover including a second rail configured to horizontally move the second cleaning body; and a controller configured to control the first mover and the second mover to perform a single-surface cleaning processing in which the second cleaning body is brought into contact with the first area and the first area is horizontally moved in a state where the substrate is sucked and held by the second holder, and perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to the upper surface or is brought into contact with the upper surface, and the second cleaning body which is in contact with the second area are horizontally moved in synchronization with each other in a state where the substrate is rotated by the first holder.

2 . The substrate processing apparatus of claim 1 , wherein the both-surface cleaning processing is performed after the single-surface cleaning processing is performed.

3 . The substrate processing apparatus of claim 2 , further comprising
a lower surface cleaning nozzle provided adjacent to the second cleaning body and configured to supply a cleaning fluid to the lower surface of the substrate held by the holder.

4 . The substrate processing apparatus of claim 3 , further comprising
an upper surface cleaning nozzle provided adjacent to the first cleaning body and configured to supply the cleaning fluid to the upper surface of the substrate held by the holder, wherein the controller is further configured to, in the both surface cleaning processing, supply the cleaning fluid from the upper surface cleaning nozzle and the lower surface cleaning nozzle, and stop the supplying of the cleaning fluid from the upper surface cleaning nozzle after the supplying of the cleaning fluid from the lower surface cleaning nozzle is stopped.

5 . The substrate processing apparatus of claim 2 , wherein the first cleaning body cleans the upper surface of the substrate by coming into contact therewith, and
the second cleaning body cleans the lower surface of the substrate by coming into contact therewith.

6 . The substrate processing apparatus of claim 5 , wherein the first moving mechanism is configured to move up and down the first cleaning body,
the second moving mechanism is configured to move up and down the second cleaning body, and the controller is configured to control at least one of the first moving mechanism and the second moving mechanism such that a pressing force of the first cleaning body against the upper surface and a pressing force of the second cleaning body against the lower surface have a same magnitude in the both-surface cleaning processing.

Assignees

• Tokyo Electron Ltd

Inventors

• Mouri Nobuhiko
• Obaru Takanori
• Takiguchi Yasushi
• Kodama Teruhiko

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title