Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
Substrate cleaning apparatus and substrate cleaning method
US2021220878A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021220878-A1 |
| Application number | US-202117152870-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 20, 2021 |
| Priority date | Jan 21, 2020 |
| Publication date | Jul 22, 2021 |
| Grant date | — |
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- Title
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Abstract
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A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.
First claim
Opening claim text (preview).
We claim: 1 . A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively, wherein a contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof. 2 . The substrate cleaning apparatus of claim 1 , wherein the contact region of the cleaning member is of a sector shape when viewed from a top. 3 . The substrate cleaning apparatus of claim 1 , wherein a circumference ratio of the cleaning member is equal to or larger than 15%. 4 . The substrate cleaning apparatus of claim 1 , wherein the cleaning member comprises a central cleaning member configured to be brought into contact with a central portion of the substrate and a peripheral cleaning member configured to be brought into contact with a peripheral portion of the substrate. 5 . The substrate cleaning apparatus of claim 1 , wherein a groove is formed on the contact region of the cleaning member. 6 . The substrate cleaning apparatus of claim 1 , wherein the cleaning member comprises a central cleaning member configured to be brought into contact with a central portion of the substrate and a peripheral cleaning member configured to be brought into contact with a peripheral portion of the substrate, a groove is formed on a contact region of each of the central cleaning member and the peripheral cleaning member which comes into contact with the substrate, and the groove of the peripheral cleaning member is larger than the groove of the central cleaning member. 7 . A substrate cleaning method of cleaning a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively, wherein the cleaning member comprises a central cleaning member configured to be brought into contact with a central portion of the substrate and a peripheral cleaning member configured to be brought into contact with a peripheral portion of the substrate, a contact region of each of the central cleaning member and the peripheral cleaning member has a shape widened in a radial shape from a central side of the substrate toward a peripheral side thereof, the substrate cleaning method comprises: rotating the cleaning member and the substrate relatively while bringing the cleaning member configured to be brought into contact with the surface of the substrate into contact with a cleaning target surface of the substrate; cleaning the central portion of the substrate by the central cleaning member; and cleaning the peripheral portion of the substrate by the peripheral cleaning member. 8 . The substrate cleaning method of claim 7 , wherein the contact region of the central cleaning member is of a sector shape when viewed from a top, and a center of the sector shape is deviated from a center of the substrate. 9 . the substrate cleaning method of claim 7 , wherein the contact region of the peripheral cleaning member is of a sector shape when viewed from a top, and a center of the sector shape is deviated from a center of the substrate.
Assignees
Inventors
Classifications
characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title
- H10P72/0412Primary
using mainly scrubbing means, e.g. brushes · CPC title
by wet cleaning only (H10P70/52 takes precedence) · CPC title
Cleaning of wafers, substrates or parts of devices · CPC title
rotating about an axis orthogonal to the surface · CPC title
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- What does patent US2021220878A1 cover?
- A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center sid…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0412. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jul 22 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).