Substrate holder

Patent metadata

Field	Value
Publication number	US-2021180204-A1
Application number	US-202017117706-A
Country	US
Kind code	A1
Filing date	Dec 10, 2020
Priority date	Dec 13, 2019
Publication date	Jun 17, 2021
Grant date	—

Abstract

There is provided a substrate holder configured to hold a substrate, the substrate holder comprising: a first holding member; and a second holding member configured to hold the substrate between the first holding member and the second holding member, wherein the first holding member comprises: at least one substrate contact arranged to come into contact with the substrate; at least one seal member provided with a first seal portion configured to cover periphery of a leading end portion of one or a plurality of the substrate contacts; and at least one bus bar electrically connected with the one or plurality of substrate contacts and provided with one or a plurality of first through holes to receive the first seal portion, wherein the leading end portion of the one or plurality of substrate contacts is arranged to pass through the first through hole from a side opposite to the second holding member toward the second holding member and is fixed to the bus bar in a state that the periphery of the leading end portion of the one or plurality of substrate contacts is covered by the first seal portion.

First claim

What is claimed is:

1 . A substrate holder configured to hold a substrate, the substrate holder comprising:
a first holding member; and a second holding member configured to hold the substrate between the first holding member and the second holding member, wherein the first holding member comprises: at least one substrate contact arranged to come into contact with the substrate; at least one seal member provided with a first seal portion configured to cover periphery of a leading end portion of one or a plurality of the substrate contacts; and at least one bus bar electrically connected with the one or plurality of substrate contacts and provided with one or a plurality of first through holes to receive the first seal portion, wherein the leading end portion of the one or plurality of substrate contacts is arranged to pass through the first through hole from a side opposite to the second holding member toward the second holding member and is fixed to the bus bar in a state that the periphery of the leading end portion of the one or plurality of substrate contacts is covered by the first seal portion.

2 . The substrate holder according to claim 1 , further comprising:
at least one power feed module provided along an outer circumference of the substrate, wherein the power feed module includes the at least one substrate contact and the seal member provided for the at least one substrate contact.

3 . The substrate holder according to claim 2 ,
wherein the power feed module includes one substrate contact and the seal member provided for the one substrate contact.

4 . The substrate holder according to claim 2 ,
wherein the first through hole of the bus bar is provided with respect to each seal member of the power feed module.

5 . The substrate holder according to claim 2 ,
wherein the at least one power feed module include a plurality of power feed modules.

6 . The substrate holder according to claim 1 ,
wherein the seal member includes a protrusion provided outside of the first seal portion, and the protrusion serves in cooperation with the first seal portion as a pressure receiver to receive a pressing force from the second holding member.

7 . The substrate holder according to claim 6 ,
wherein the bus bar has a second through hole provided to receive the protrusion of the seal member, and the protrusion is arranged to pass through the second through hole and to be extended toward the second holding member.

8 . The substrate holder according to claim 1 ,
wherein the first holding member further includes a first plate, the substrate contact has a base end portion that is placed between the first plate and the seal member, and the seal member further includes a second seal portion configured to seal between the first plate and the seal member and protect the substrate contact.

9 . The substrate holder according to claim 1 ,
wherein the seal member has a third through hole that makes the bus bar exposed on a connecting location where the bus bar is connected with the substrate contact, and the seal member further includes a third seal portion configured to seal between the bus bar and the seal member in a periphery of the third through hole on a bus bar side.

10 . The substrate holder according to claim 9 ,
wherein the bus bar further includes a projection that is to be inserted into the third through hole, and is electrically connected with the substrate contact at the projection.

11 . The substrate holder according to claim 1 ,
wherein the seal member has a fourth through hole, and the leading end portion of the substrate contact is in close contact with the seal member inside of the fourth through hole.

12 . The substrate holder according to claim 11 ,
wherein the substrate contact is stuck to the seal member inside of the fourth through hole.

13 . The substrate holder according to claim 1 ,
wherein the leading end portion of the substrate contact is divided into a plurality of leaf electrodes.

14 . The substrate holder according to claim 1 ,
wherein the substrate is in a polygonal shape, and the substrate contact and the seal member are provided on each of two opposed sides of the substrate.

15 . The substrate holder according to claim 2 , further comprising:
a dummy member attached to a non-mounting part of the bus bar where neither the substrate contact nor the seal member is mounted.

16 . A plating apparatus, comprising:
the substrate holder according to claim I; and a plating device configured to plate a substrate held by the substrate holder.

17 . A method of holding a substrate by a substrate holder, the method comprising:
holding the substrate by the substrate holder that is provided with at least one substrate contact electrically connected with a bus bar and that includes a leading end of the substrate contact fixed through a through hole of the bus bar from a side opposite to a substrate side toward the substrate side in such a state that a periphery of the leading end portion of the substrate contact is covered by a seal member; and bringing the leading end portion of the substrate contact and the seal member in contact with an exposed area of a seed layer that is not covered by a resist on an outer circumference of the substrate.

Assignees

• Ebara Corp

Inventors

• Miyamoto Matsutaro

Classifications

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D7/12

  Semiconductors · CPC title

• C25D17/08 Primary

  Supporting} racks {, i.e. not for suspending · CPC title

• C25D17/004

  Sealing devices · CPC title

• C25D17/005

  Contacting devices · CPC title