Substrate treating apparatus

Patent metadata

Field	Value
Publication number	US-2021082721-A1
Application number	US-202017102615-A
Country	US
Kind code	A1
Filing date	Nov 24, 2020
Priority date	Nov 13, 2015
Publication date	Mar 18, 2021
Grant date	—

Abstract

A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

First claim

What is claimed is:

1 . A substrate treating apparatus comprising:
a treating block having:
a transporting space including a first divided transporting space and a second divided transporting space,
the first divided transporting space corresponding to an upper part of the transporting space;
the second divided transporting space corresponding to a lower part of the transporting space;
a first main transport mechanism installed in the first divided transporting space, and
a second main transport mechanism installed in the second divided transporting space; and
a transporting space gas supply device configured to supply gas to the transporting space; wherein the transporting space gas supply device includes:
a supply fan installed outside the transporting space;
a first supply pipe configured to communicate the supply fan with the first transporting space; and
a second supply pipe configured to communicate the supply fan with the second transporting space.

2 . The substrate treating apparatus according to claim 1 , wherein:
the supply fan comprises a primary side thereof open to the exterior of the substrate treating apparatus; and the supply fan is configured to take in ambient gas from outside the substrate treating apparatus, and send the gas into the transporting space.

3 . The substrate treating apparatus according to claim 1 , wherein the supply fan is disposed above the treating block.

4 . The substrate treating apparatus according to claim 3 , wherein the supply fan is disposed above the transporting space.

5 . The substrate treating apparatus according to claim 4 , wherein the supply fan is disposed on an upper surface of an upper wall of the first divided transporting space.

6 . The substrate treating apparatus according to claim 1 , wherein:
the first supply pipe is connected to one side of the supply fan; and the second supply pipe is connected to the other side of the supply fan.

7 . The substrate treating apparatus according to claim 1 , wherein:
the first supply pipe extends downward from the supply fan; and the second supply pipe extends downward from the supply fan.

8 . The substrate treating apparatus according to claim 1 , wherein:
the first supply pipe is provided from the outside of the transporting space to the inside of the first divided transporting space; and the second supply pipe is provided from the outside of the transport space to the inside of the second divided transporting space.

9 . The substrate treating apparatus according to claim 8 , wherein:
the first supply pipe penetrates an upper wall of the first divided transporting space; and the second supply pipe penetrates the upper wall of the first divided transporting space and passes through the first divided transporting space.

10 . The substrate treating apparatus according to claim 9 , wherein the treating block comprises:
a solution treating unit provided on one side of the transporting space; and a heat treating unit provided on the other side of the transporting space; and wherein the second supply pipe passes through one side of the first divided transporting space near the solution treating unit.

11 . The substrate treating apparatus according to claim 1 , wherein the transporting space gas supply device comprises:
a first blowout unit connected to the first supply pipe and configured to blow out gas to the first divided transporting space; and a second blowout unit connected to the second supply pipe and configured to blow out gas to the second divided transporting space.

12 . The substrate treating apparatus according to claim 11 , wherein:
the first blowout unit is installed in an upper part of the first divided transporting space; and the second blowout unit is installed in an upper part of the second divided transporting space.

13 . The substrate treating apparatus according to claim 12 , wherein:
the supply fan is in contact with an upper surface of an upper wall of the first divided transporting space; and the first blowout unit is in contact with a lower surface of the upper wall of the first divided transporting space.

14 . The substrate treating apparatus according to claim 1 , wherein the transporting space gas supply device comprises a filter installed on a primary side or a secondary side of the supply fan.

15 . The substrate treating apparatus according to claim 1 , wherein the first transporting space and the second transporting space are separated from each other.

Assignees

• Screen Holdings Co Ltd

Inventors

• Maeda Masafumi

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0456

  in-line arrangement · CPC title