Polyimide resin composition and metal base substrate
US-2024117119-A1 · Apr 11, 2024 · US
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SUSUKI Kyoka patents
SUSUKI Kyoka is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | SUSUKI Kyoka |
| Total patents | 8 |
| First publication | Dec 3, 2020 |
| Latest publication | Apr 11, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit board
US-2023038219-A1 · Feb 9, 2023 · US
Method of producing copper oxide powder, and copper oxide powder
US-2023027568-A1 · Jan 26, 2023 · US
Tin or tin alloy plating solution
US-11268203-B2 · Mar 8, 2022 · US
Tin or tin alloy plating solution
US-11162182-B2 · Nov 2, 2021 · US
Tin or tin-alloy plating liquid, bump forming method, and circuit board production method
US-2021040636-A1 · Feb 11, 2021 · US
Tin or tin alloy plating solution
US-2020378024-A1 · Dec 3, 2020 · US
Tin or tin alloy plating solution
US-2020378025-A1 · Dec 3, 2020 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Materials Corp | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/00 | 6 |
| C25D3/32 | 6 |
| C25D3/60 | 6 |
| H05K3/4007 | 6 |
| C25D5/505 | 6 |