Heating apparatus, heating method, and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-2020411340-A1
Application number	US-202016912203-A
Country	US
Kind code	A1
Filing date	Jun 25, 2020
Priority date	Jun 28, 2019
Publication date	Dec 31, 2020
Grant date	—

Abstract

An apparatus for heating a heating target object includes: a heating member for supporting the heating target object; an electromagnetic wave irradiation part for irradiating an electromagnetic wave to an irradiation surface of the heating member, which is opposite to a surface supporting the heating target object; and a controller. The electromagnetic wave irradiation part includes: an electromagnetic wave output part for outputting the electromagnetic wave; and an antenna unit. The antenna unit includes antenna modules each having an antenna for radiating radiate the electromagnetic wave and a phase shifter for adjusting phase of the electromagnetic wave radiated from the antenna. The controller controls the phase shifters of the antenna modules so that phases of electromagnetic waves radiated from a plurality of the antenna are condensed on an arbitrary portion of the heating member by interference, and a condensed portion of the electromagnetic waves is scanned on the irradiation surface.

First claim

What is claimed is:

1 . A heating apparatus for heating a heating target object, comprising:
a heating member configured to support the heating target object and made of an electromagnetic wave absorber; an electromagnetic wave irradiation part configured to irradiate an electromagnetic wave to an irradiation surface of the heating member positioned opposite to a surface supporting the heating target object; and a controller, wherein the electromagnetic wave irradiation part comprises: an electromagnetic wave output part configured to output the electromagnetic wave; and an antenna unit constituting a phased array antenna, the antenna unit further comprises: a plurality of antenna modules each having an antenna configured to radiate the electromagnetic wave and a phase shifter configured to adjust a phase of the electromagnetic wave radiated from the antenna, and the controller is configured to control the phase shifters of the plurality of antenna modules so that phases of electromagnetic waves radiated from a plurality of the antenna are condensed on an arbitrary portion of the heating member by interference, and a condensed portion of the electromagnetic waves is scanned on the irradiation surface of the heating member.

2 . The heating apparatus of claim 1 , wherein the heating member is made of a carbon-based material.

3 . The heating apparatus of claim 2 , wherein the antenna is a monopole antenna.

4 . The heating apparatus of claim 3 , wherein the antenna unit further comprises a conductive connection member configured to connect adjacent antennas of the plurality of antennas installed in the plurality of antenna modules.

5 . The heating apparatus of claim 4 , wherein the controller is configured to control a scanning speed of the condensed portion so that the heating target object has a uniform temperature distribution.

6 . The heating apparatus of claim 5 , wherein the heating target object is a substrate.

7 . The heating apparatus of claim 1 , wherein the antenna is a monopole antenna.

8 . The heating apparatus of claim 1 , wherein the controller is configured to control a scanning speed of the condensed portion so that the heating target object has a uniform temperature distribution.

9 . The heating apparatus of claim 1 , wherein the controller is configured to change a scanning speed of the condensed portion so that the heating target object has a specific temperature distribution.

10 . The heating apparatus of claim 1 , wherein the heating target object is a substrate.

11 . A method of heating a heating target object, the method comprising:
supporting the heating target object by a heating member made of an electromagnetic wave absorber; supplying an electromagnetic wave to an antenna unit constituting a phased array antenna which includes a plurality of antenna modules each having an antenna configured to radiate the electromagnetic wave and a phase shifter configured to adjust a phase of the electromagnetic wave radiated from the antenna, and radiating the electromagnetic waves from a plurality of the antenna; and controlling the phase shifters of the plurality of antenna modules so that phases of electromagnetic waves radiated from the plurality of antennas are condensed on an arbitrary portion of the heating member through interference, and a condensed portion of the electromagnetic waves is scanned on an irradiation surface of the heating member.

12 . The method of claim 11 , wherein the heating member is made of a carbon-based material.

13 . The method of claim 12 , wherein the antenna is a monopole antenna.

14 . The method of claim 13 , wherein the antenna unit further comprises a conductive connection member configured to connect adjacent antennas of the plurality of antennas installed in the plurality of antenna modules.

15 . The method of claim 14 , further comprising: controlling a scanning speed of the condensed portion so that the heating target object has a uniform temperature distribution.

16 . The method of claim 15 , wherein the heating target object is a substrate.

17 . The method of claim 11 , wherein the antenna is a monopole antenna.

18 . The method of claim 11 , further comprising: controlling the heating target object to have a specific temperature distribution by changing a scanning speed of the condensed portion.

19 . The method of claim 11 , wherein the heating target object is a substrate.

20 . A substrate processing apparatus for performing a process on a substrate while heating the substrate, comprising:
a chamber in which the substrate is accommodated; the heating apparatus of claim 1 , which heats the substrate as an heating target object; and a processing mechanism configured to process the substrate, wherein the process is performed on the substrate while heating the substrate with the heating apparatus.

Assignees

• Tokyo Electron Ltd

Inventors

• Ikeda Taro
• Watanabe Naoki
• Hatano Tatsuo
• Yamamoto Nobuhiko
• Kamata Eiki

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H05B6/72

  Radiators or antennas · CPC title

• C23C16/4586

  Elements in the interior of the support, e.g. electrodes, heating or cooling devices · CPC title

• H05B6/80

  Apparatus for specific applications (stoves or ranges F24C7/02) · CPC title