Cooling system for processing chamber
US-2024393018-A1 · Nov 28, 2024 · US
Wafer holder
US2020340102A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020340102-A1 |
| Application number | US-201816498853-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 8, 2018 |
| Priority date | Mar 28, 2017 |
| Publication date | Oct 29, 2020 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.
First claim
Opening claim text (preview).
1 . A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other. 2 . The wafer holder according to claim 1 , further comprising: a cylindrical support configured to support a lower surface of the ceramic base; and an electrode terminal portion connected to the pull-out portion, wherein a portion of the electrode terminal portion protrudes from the lower surface of the ceramic base and is housed in the cylindrical support. 3 . The wafer holder according to claim 1 , wherein the conductive member constitutes an RF electrode or a resistance heating element. 4 . The wafer holder according to claim 1 , comprising a plurality of the conductive members, each of the plurality of the conductive members constituting an RF electrode or a resistance heating element. 5 . The wafer holder according to claim 1 , further comprising: a second circuit portion embedded in the ceramic base and provided parallel to the wafer-mounting surface; and a second electrode terminal portion connected to the second circuit portion, wherein a portion of the second electrode terminal portion protrudes from the lower surface of the ceramic base. 6 . The wafer holder according to claim 5 , wherein the second circuit portion is an RF electrode or a resistance heating element or an electrostatic chuck electrode. 7 . The wafer holder according to claim 1 , wherein the connecting portion is a ceramic member covered with a metal layer. 8 . The wafer holder according to claim 1 , wherein the ceramic base has a disk shape. 9 . The wafer holder according to claim 2 , wherein the cylindrical support has a circular cylindrical shape.
Assignees
Inventors
Classifications
- H10P72/72Primary
using electrostatic chucks · CPC title
in the presence of a plasma [PECVD] · CPC title
- H10P72/0432Primary
mainly by conduction · CPC title
Elements in the interior of the support, e.g. electrodes, heating or cooling devices · CPC title
- C23C16/458Primary
characterised by the method used for supporting substrates in the reaction chamber · CPC title
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- What does patent US2020340102A1 cover?
- A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward …
- Who is the assignee on this patent?
- Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification H10P72/72. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Oct 29 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).