Apparatus for surpoting substrate and manufacturing mathod threrof

Patent metadata

Field	Value
Publication number	US-2020118860-A1
Application number	US-201916599155-A
Country	US
Kind code	A1
Filing date	Oct 11, 2019
Priority date	Oct 15, 2018
Publication date	Apr 16, 2020
Grant date	—

Abstract

An apparatus for supporting a substrate is proposed. The apparatus includes: a base plate including at least one first gas supply hole formed therein so as to allow supply of a temperature control gas; and an electrostatic chuck provided on the base plate to support the substrate, and including at least one second gas supply hole formed therein so as to be in communication with the at least one first gas supply hole, wherein the at least one second gas supply hole is formed before sintering of the electrostatic chuck.

First claim

What is claimed is:

1 . An apparatus for supporting a substrate, the apparatus comprising:
a base plate including at least one first gas supply hole formed therein so as to allow supply of a temperature control gas; and an electrostatic chuck provided on the base plate to support the substrate, and including at least one second gas supply hole formed therein so as to be in communication with the at least one first gas supply hole, wherein the at least one second gas supply hole is formed before sintering of the electrostatic chuck.

2 . The apparatus of claim 1 , wherein the at least one second gas supply hole is smaller in diameter than the at least one first gas supply hole.

3 . The apparatus of claim 1 , wherein the second gas supply holes have different diameters.

4 . The apparatus of claim 1 , wherein the second gas supply holes are grouped into a plurality of groups of second gas supply holes, such that one group of the plurality of groups of second gas supply holes is disposed within a diameter range of one of the at least one first gas supply hole.

5 . The apparatus of claim 4 , wherein the second gas supply holes are arranged at irregular intervals.

6 . The apparatus of claim 1 , wherein the base plate and the electrostatic chuck are bonded together by an adhesive layer.

7 . The apparatus of claim 1 , further comprising:
a porous body provided inside the at least one first gas supply hole.

8 . A method of manufacturing an apparatus for supporting a substrate, the method comprising:
forming a first gas supply hole in a base plate; forming a second gas supply hole in an electrostatic chuck; sintering the electrostatic chuck so as to reduce a diameter of the second gas supply hole; and fixing the sintered electrostatic chuck onto the base plate such that the first and second gas supply holes communicate with each other.

9 . The method of claim 8 , wherein in the forming of the second gas supply hole in the electrostatic chuck, a plurality of second gas supply holes is formed to be disposed within a diameter range of the first gas supply hole.

10 . The method of claim 8 , further comprising:
supplying a fluid into the second gas supply hole at a predetermined pressure after the sintering of the electrostatic chuck.

Assignees

• Semes Co Ltd

Inventors

• Lee Sang Kee
• Lee Jae Kyung

Classifications

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H01L21/6833 Primary

  Electricity · mapped topic

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title