Substrate processing apparatus and purging method

US2020083078A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020083078-A1
Application numberUS-201916549418-A
CountryUS
Kind codeA1
Filing dateAug 23, 2019
Priority dateSep 6, 2018
Publication dateMar 12, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.

First claim

Opening claim text (preview).

What is claimed is: 1 . A substrate processing apparatus comprising: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed in the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information. 2 . The substrate processing apparatus according to claim 1 , wherein the carrier information includes at least one of a carrier type and a carrier manufacturer. 3 . The substrate processing apparatus according to claim 2 , wherein the substrate information includes at least one of presence or absent of the substrate, number of substrates, and a usage state of the substrate in the carrier. 4 . The substrate processing apparatus according to claim 3 , wherein the controller controls the gas supply such that the inert gas is intermittently supplied into the carrier when the inert gas is supplied into the carrier. 5 . The substrate processing apparatus according to claim 4 , further comprising: a differential pressure gauge configured to measure a pressure difference between an inside of the carrier and an outside of the carrier, wherein the controller controls the gas supply such that the inert gas is supplied into the carrier when the pressure difference measured by the differential pressure gauge is a predetermined threshold value or less. 6 . The substrate processing apparatus according to claim 1 , wherein the substrate information includes at least one of presence or absent of the substrate, number of substrates, and a usage state of the substrate in the carrier. 7 . The substrate processing apparatus according to claim 1 , wherein the controller controls the gas supply such that the inert gas is intermittently supplied into the carrier when the inert gas is supplied into the carrier. 8 . The substrate processing apparatus according to claim 1 , further comprising: a differential pressure gauge configured to measure a pressure difference between an inside of the carrier and an outside of the carrier, wherein the controller controls the gas supply such that the inert gas is supplied into the carrier, when the pressure difference measured by the differential pressure gauge is a predetermined threshold value or less. 9 . A substrate processing apparatus comprising: a carrier conveyance area where a carrier accommodating a substrate is carried in/carried out; a wafer conveyance area where the substrate in the carrier carried into the carrier conveyance area is conveyed to be carried into a processing furnace; and a controller, wherein the carrier conveyance area includes: a carrier storage rack configured to place and store a carrier; a carrier stage on which the carrier is placed when the substrate in the carrier is conveyed to the wafer conveyance area; and a gas supply configured to supply an inert gas into the carrier placed in the carrier storage rack and the carrier stage; and the controller controls whether to supply the inert gas into the carrier placed on the carrier storage rack, based on at least one of carrier information and substrate information, and further controls a time for supplying the inert gas into the carrier, based on whether the carrier placed on the carrier stage is the carrier supplied with the inert gas in the carrier storage rack. 10 . A purging method comprising: placing a carrier accommodating a substrate on a carrier storage rack; determining whether to supply an inert gas into the carrier based on at least one of carrier information and substrate information; and supplying the inert gas into the carrier placed on the carrier storage rack, when determined to supply the inert gas in the determining.

Assignees

Inventors

Classifications

  • Docking arrangements · CPC title

  • Storage means · CPC title

  • using identification means, e.g. labels on substrates or labels on containers · CPC title

  • Position monitoring, e.g. misposition detection or presence detection · CPC title

  • mainly by convection · CPC title

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Frequently asked questions

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What does patent US2020083078A1 cover?
A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Mar 12 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).