Silicon carbide semiconductor device manufacturing method and silicon carbide semiconductor device
US-2015380243-A1 · Dec 31, 2015 · US
US2020002168A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020002168-A1 |
| Application number | US-201816484945-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 28, 2018 |
| Priority date | Sep 29, 2017 |
| Publication date | Jan 2, 2020 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A chalcogen-containing compound of the following chemical formula which exhibits an excellent thermoelectric performance index (ZT) through an increase in power factor and a decrease in thermal conductivity, a method for preparing the same, and a thermoelectric element including the same: M y V 1-y Sn x Sb 2 Te x+3 , wherein V is vacancy, M is at least one alkali metal, x≥6, and 0<y≤0.4.
Opening claim text (preview).
1 . A chalcogen-containing compound represented by the following Chemical Formula 1: M y V 1-y Sn x Sb 2 Te x+3 [Chemical Formula 1] wherein, in the above Chemical Formula 1, V is vacancy, M is at least one alkali metal, x≥6, and 0<y≤0.4. 2 . The chalcogen-containing compound of claim 1 , wherein the M is at least one alkali metal selected from the group consisting of Na and K. 3 . The chalcogen-containing compound of claim 1 , wherein the chalcogen-containing compound has a face-centered cubic crystal lattice structure. 4 . The chalcogen-containing compound of claim 3 , wherein the V is a vacant site excluding sites filled with Sn, Sb, and Te in the face-centered cubic lattice structure, and the M is filled in a part of the V. 5 . The chalcogen-containing compound of claim 3 , wherein the Te is filled in an anion site of the face-centered cubic lattice structure, the Sn and Sb are filled in a cationic site of the face-centered cubic lattice structure, the V is a vacant site of the remaining cationic sites excluding the sites filled with Sn and Sb, and the M is filled in a part of the V. 6 . The chalcogen-containing compound of claim 3 , wherein the V, Sn, Sb, and M are randomly distributed at a site of (x, y, z)=(0, 0, 0), and Te is distributed at a site of (x, y, z)=(0.5, 0.5, 0.5). 7 . The chalcogen-containing compound of claim 1 , wherein 6≤x≤12 and 0.01≤y≤0.4. 8 . The chalcogen-containing compound of claim 1 , which is selected from the group consisting of Na 0.2 V 0.8 Sn 6 Sb 2 Te 9 , Na 0.2 V 0.8 Sn 8 Sb 2 Te 11 , Na 0.2 V 0.8 Sn 10 Sb 2 Te 13 , Na 0.2 V 0.8 Sn 12 Sb 2 Te 15 , Na 0.1 V 0.9 Sn 8 Sb 2 Te 11 , and Na 0.4 V 0.6 Sn 8 Sb 2 Te 11 . 9 . A method for preparing the chalcogen-containing compound of claim 1 comprising: mixing raw materials of Sn, Sb, Te, and M so that a molar ratio of Sn:Sb:Te:M is x:2:(x+3):y and then subjecting the mixture to a melting reaction wherein x≥6 and 0<y≤0.4, and M is at least one alkali metal; heat-treating the resultant product obtained through the melting reaction; pulverizing the resultant product obtained through the heat treatment; and sintering the pulverized product. 10 . The method for preparing the chalcogen-containing compound of claim 9 , wherein the melting is carried out at a temperature of 700 to 900° C. 11 . The method for preparing the chalcogen-containing compound of claim 9 , wherein the heat treatment is carried out at a temperature of 550 to 640° C. 12 . The method for preparing the chalcogen-containing compound of claim 9 , further comprising a step of cooling the resultant of the heat treatment step to form an ingot between the heat treatment step and the pulverization step. 13 . The method for preparing the chalcogen-containing compound of claim 9 , wherein the sintering is carried out by a spark plasma sintering method. 14 . The method for preparing the chalcogen-containing compound of claim 9 , wherein the sintering is carried out at a temperature of 550 to 640° C. under a pressure of 10 to 100 MPa. 15 . A thermoelectric element comprising the chalcogen-containing compound of claim 1 .
Epitaxial-layer growth · CPC title
Treatment time · CPC title
Flame, plasma or melting treatment · CPC title
Multi-step sintering · CPC title
Metallic constituents or additives not added as binding phase · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.