Rapid processing of laminar composite components
US-12180120-B2 · Dec 31, 2024 · US
Multi-step sintering
Multi-step sintering · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2235/661 |
| Official title | Multi-step sintering |
| Display label | Multi-step sintering |
| Total patents | 853 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 54 |
| 2016 | 67 |
| 2017 | 67 |
| 2018 | 73 |
| 2019 | 90 |
| 2020 | 68 |
| 2021 | 87 |
| 2022 | 82 |
| 2023 | 84 |
| 2024 | 91 |
| 2025 | 66 |
| 2026 | 24 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solid-state structures with volatile sintering aids, and methods for fabrication and use thereof
US-2024429439-A1 · Dec 26, 2024 · US
Sintered body, method for producing the same, and orthodontic bracket
US-2024300859-A1 · Sep 12, 2024 · US
Fast firing method for high porosity ceramics
US-2016368825-A1 · Dec 22, 2016 · US
Transparent ceramic, method for manufacturing same, and magneto-optical device
US-9470915-B2 · Oct 18, 2016 · US
Handle Substrate, Composite Substrate for Semiconductor, and Semiconductor Circuit Board and Method for Manufacturing the Same
US-2016005643-A1 · Jan 7, 2016 · US
Light transmitting metal oxide sintered body manufacturing method and light transmitting metal oxide sintered body
US-2015376023-A1 · Dec 31, 2015 · US
Handle Substrates of Composite Substrates for Semiconductors
US-2015376066-A1 · Dec 31, 2015 · US
Seal ring and associated method
US-2015380696-A1 · Dec 31, 2015 · US
Polycrystalline diamond compact, and related methods and applications
US-2015361727-A1 · Dec 17, 2015 · US
Handle Substrates of Composite Substrates for Semiconductors, and Composite Substrates for Semiconductors
US-2015364548-A1 · Dec 17, 2015 · US
Handle Substrate and Composite Wafer for Semiconductor Device
US-2015357221-A1 · Dec 10, 2015 · US
Transparent spinel ceramics and method for the production thereof
US-2015344372-A1 · Dec 3, 2015 · US
Powder comprising stabilized zirconia granules and a binder having Tg of 25C or lower
US-9193630-B2 · Nov 24, 2015 · US
Composite sintered body
US-2015328691-A1 · Nov 19, 2015 · US
Semiconductor ceramic composition, method for producing the same, and PTC element
US-9190194-B2 · Nov 17, 2015 · US
Aluminum nitride substrate for circuit board and production method thereof
US-9190189-B2 · Nov 17, 2015 · US
Colored translucent zirconia sintered body, its production process and its use
US-9174877-B2 · Nov 3, 2015 · US
Ceramic scintillator body and scintillation device
US-9175216-B2 · Nov 3, 2015 · US
Porous mullite bodies having improved thermal stability
US-2015299045-A1 · Oct 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2235/661?
- CPC C04B2235/661 is the Cooperative Patent Classification code for “Multi-step sintering.”
- How many patents are filed under CPC C04B2235/661 (Multi-step sintering)?
- Our database includes 853 publications tagged with this CPC code.
- Is patent activity under CPC C04B2235/661 growing?
- Publication counts under this code: 91 in 2024 vs 66 in 2025 (latest complete years).