Structures having selectively metallized regions and methods of manufacturing the same
US-2015176132-A1 · Jun 25, 2015 · US
Plating method, plating apparatus and recording medium
US2019271084A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019271084-A1 |
| Application number | US-201716345320-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 29, 2017 |
| Priority date | Oct 27, 2016 |
| Publication date | Sep 5, 2019 |
| Grant date | — |
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- Title
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Abstract
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A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.
First claim
Opening claim text (preview).
We claim: 1 . A plating method, comprising: preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface thereof; imparting a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate; and forming a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate, wherein the plating liquid contains an inhibitor which suppresses the plating layer from being precipitated on the non-plateable material portion. 2 . The plating method of claim 1 , wherein the inhibitor is bis(3-sulfopropyl)disulfide (SPS) or polymer having an amino group. 3 . The plating method of claim 1 , wherein the substrate includes a base member made of the plateable material portion and a core member which is protruded from the base member and is made of the non-plateable material portion. 4 . A plating apparatus, comprising: a substrate holding unit configured to hold a substrate having a plateable material portion and a non-plateable material portion on a surface thereof; a catalyst imparting unit configured to impart a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate; and a plating liquid supply unit configured to form a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate, wherein the plating liquid contains an inhibitor which suppresses the plating layer from being precipitated on the non-plateable material portion. 5 . The plating apparatus of claim 4 , wherein the inhibitor is bis(3-sulfopropyl)disulfide (SPS) or polymer having an amino group. 6 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method as claimed in claim 1 .
Assignees
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Classifications
using a liquid · CPC title
with use of metal first · CPC title
with use of metal first · CPC title
using reducing agents · CPC title
from pretreatment step, i.e. selective pre-treatment · CPC title
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- What does patent US2019271084A1 cover?
- A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating li…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C18/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Sep 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).