Substrate processing method and substrate processing system
US-2024173742-A1 · May 30, 2024 · US
US2019241844A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019241844-A1 |
| Application number | US-201916250069-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 17, 2019 |
| Priority date | Feb 7, 2018 |
| Publication date | Aug 8, 2019 |
| Grant date | — |
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A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.
Opening claim text (preview).
What is claimed is: 1 . A cleaning composition, comprising: a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035. 2 . The cleaning composition as claimed in claim 1 , wherein the surfactant is a sulfate-based surfactant. 3 . The cleaning composition as claimed in claim 1 , wherein the surfactant is represented by the following Formula 1: (R 1 —O) a —(R 2 —O) b —SO 3 NH 4 (1) wherein, in Formula 1, a and b are each an integer of 0 to 18, provided that a and b are not simultaneously 0, R 1 is a substituted or unsubstituted alkyl group or having 1 to 18 carbon atoms, a substituted or unsubstituted alkylene group having 1 to 18 carbon atoms, or a substituted or unsubstituted arylene group having 6 to 14 carbon atoms, and when a is 3 to 18, (R 1 —O) is repeated randomly or in a block form. 4 . The cleaning composition as claimed in claim 3 , wherein: a is 1, R 1 has 16 carbon atoms, b is 0, and the surfactant is ammonium hexadecyl sulfate. 5 . The cleaning composition as claimed in claim 1 , wherein the organic compound includes isopropyl alcohol, ethyl alcohol, methyl alcohol, dimethyl sulfoxide, dimethylformamide, tetrahydrofuran, ethylene glycol, propylene glycol, N-methyl-2-pyrrolidone, or N-ethyl-2-pyrrolidone. 6 . A cleaning apparatus for cleaning a substrate, the cleaning apparatus comprising: a chuck on which the substrate is receivable; a nozzle configured to provide a cleaning liquid to the substrate; and a cleaning liquid supply configured to supply the cleaning liquid to the nozzle, and configured to generate cleaning particles by stirring the cleaning liquid, wherein the cleaning liquid supply includes: an electrical conductivity meter configured to measure the electrical conductivity of the cleaning liquid, and a thermostat configured to cool the cleaning liquid when the electrical conductivity of the cleaning liquid decreases. 7 . The cleaning apparatus as claimed in claim 6 , wherein the cleaning liquid supply further includes: a source supply configured to store a chemical source of the cleaning liquid, a deionized water supply configured to store deionized water for diluting the chemical source, and a cleaning liquid circulator configured to generate the cleaning particles in the cleaning liquid by mixing the deionized water and the chemical source. 8 . The cleaning apparatus as claimed in claim 7 , wherein the cleaning liquid circulator includes: a chemical tank configured to store the cleaning liquid, a circulation line configured to circulate the cleaning liquid in the chemical tank, and a pump connected to the circulation line and configured to pump the cleaning liquid, and wherein the electrical conductivity meter is coupled with the chemical tank. 9 . The cleaning apparatus as claimed in claim 8 , wherein: the cleaning liquid circulator further includes a stirrer configured to stir the cleaning liquid in the chemical tank, and the stirrer includes a porous tube having perforated holes, which are open toward a top of the chemical tank. 10 . The cleaning apparatus as claimed in claim 8 , wherein the thermostat is connected to the circulation line. 11 . The cleaning apparatus as claimed in claim 7 , wherein, when the deionized water and the chemical source are mixed, the thermostat heats the chemical source. 12 . A method of fabricating a semiconductor device, the method comprising: preparing a cleaning liquid; cleaning a substrate using the cleaning liquid; and drying the substrate, wherein the preparing the cleaning liquid includes: providing deionized water into a chemical tank; and generating the cleaning liquid by mixing a chemical source of the cleaning liquid in the deionized water, wherein the cleaning liquid includes a surfactant, deionized water, and an organic compound, wherein the surfactant is included in the cleaning liquid in a concentration of about 0.04 M to about 0.004 M or a mole fraction of about 0.0003 to about 0.0004, and wherein the organic compound is included in the cleaning liquid in a concentration of about 0.17 M to about 0.57 M or a mole fraction of about 0.005 to about 0.008. 13 . The method as claimed in claim 12 , wherein preparing the cleaning liquid further includes generating seeds of cleaning particles by heating the cleaning liquid to a first temperature. 14 . The method as claimed in claim 13 , wherein the first temperature is about 26° C. 15 . The method as claimed in claim 13 , wherein: preparing the cleaning liquid further includes: detecting an electrical conductivity of the cleaning liquid; and determining whether the seeds have been generated based on the detected electrical conductivity of the cleaning liquid, and determining whether the seeds have been generated includes determining whether the electrical conductivity of the cleaning liquid has decreased. 16 . The method as claimed in claim 15 , wherein the seeds are plate-shaped and have a thickness of 1 μm or less. 17 . The method as claimed in claim 15 , wherein preparing the cleaning liquid further includes growing the cleaning particles from the seeds by cooling the cleaning liquid to a second temperature, the second temperature being lower than the first temperature, if the seeds have been generated. 18 . The method as claimed in claim 17 , wherein the second temperature is about 18° C. 19 . The method as claimed in claim 17 , wherein: preparing the cleaning liquid further includes determining whether the electrical conductivity of the cleaning liquid is saturated, and when the electrical conductivity of the cleaning liquid is saturated, the cleaning particles have a hexahedral or cubic shape. 20 . The method as claimed in claim 17 , wherein the cleaning particles have horizontal and vertical lengths of about 20 μm to about 200 μm and a thickness of about 1 μm to about 10 μm.
characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title
using mainly spraying means, e.g. nozzles · CPC title
Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title
Cleaning during device manufacture · CPC title
for drying · CPC title
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