System and method of inspecting substrate and method of fabricating semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-2019033232-A1
Application number	US-201815959347-A
Country	US
Kind code	A1
Filing date	Apr 23, 2018
Priority date	Jul 28, 2017
Publication date	Jan 31, 2019
Grant date	—

Abstract

A substrate inspection system includes a substrate support, optics configured to irradiate a patterned structure on the substrate and capture images of the patterned structure from light reflected from the patterned structure, a focus adjustment operative to adjust a focal position of the incident light on the patterned structure, and an image processor configured to calculate an optimal value of a focus offset used to establish focal points of the light for defect detection in the patterned structure. The patterned structure may include a first pattern having an opening and a second pattern having top surfaces located at different heights relative to the substrate. The value of the focus offset is determined using images of the top surfaces of the second pattern obtained while changing the focal position of the incident light.

First claim

1 - 10 . (canceled)

11 . An inspection method for use in quality control of semiconductor devices, comprising:
determining an optimal focus offset value; irradiating a layered structure on a substrate with incident light focused based on the optimal focus offset value, the layered structure comprising a first pattern having a top surface and an opening therein and a second pattern having top surfaces located at different heights relative to a top surface of the substrate, the opening extending in a direction perpendicular to a top surface of the substrate from the top surface of the first pattern; capturing an image of the layered structure from light reflected from the layered structure as a result of the irradiating of the layered structure; and detecting for a defect in the layered structure using the captured image of the layered structure, wherein the determining of the optimal focus offset value comprises: capturing focus offset images each of a region of the layered structure including the top surfaces of the second pattern while changing a focal position of the incident light, whereby the focus offset images are captured at different focal positions of the incident light; and calculating the optimal focus offset value using the focus offset images.

12 . The method of claim 11 , wherein the determining of the optimal focus offset value comprises:
selecting regions of the focus offset images as comparison regions, respectively; quantifying the contrast of each of the comparison regions of the focus offset images; determining which of the comparison regions has the greatest contrast; and basing the optimal focus offset value on a focus offset value of the focus offset image whose comparison region has the greatest contrast among the comparison regions of the focus offset images.

13 . The method of claim 12 , wherein the focus offset value corresponds to a distance, along an optical axis along which the incident light propagates, between a predetermined reference focal position and the focal position of the focus offset image whose comparison region has the greatest contrast among the comparison regions of the focus offset images.

14 . The method of claim 12 , wherein the comparison regions of the focus offset images are each of a region of a same one of the top surfaces of the second pattern, closest to a vertical position of a defect desired to be detected.

15 . The method of claim 14 , wherein the defect desired to be detected is a pattern failure of the opening.

16 . The method of claim 15 , wherein the pattern failure of the opening is a not-open failure of the opening, and
the comparison regions of the focus offset images are each a region of the lowermost one of the top surfaces of the second pattern.

17 . The method of claim 11 , wherein the determining of the optimal focus offset value further comprises performing a substrate alignment operation of adjusting a position of the substrate in a plane perpendicular to an optical axis along which the incident light propagates, before the capturing of the focus offset images.

18 . The method of claim 11 , wherein the top surfaces of the second pattern constitute a staircase portion having a height that decreases with an increase in distance in a given a direction from the first pattern.

19 . The method of claim 11 , wherein the detecting for the defect in the layered structure on the substrate comprises:
determining a detection focal position using the optimal focus offset value; and scanning the substrate with light focused at the detection focal position.

20 . The method of claim 19 , wherein the detection focal position is obtained by adding or subtracting the optimal focus offset value to or from a predetermined reference focal position.

21 . A method of fabricating a semiconductor device, comprising:
forming a preliminary structure comprising a stack of layers on a substrate; patterning the preliminary structure to form a layered structure having a staircase portion constituted by ends of the layers, and a pattern of vertical holes in the layers to expose the substrate; and performing a substrate inspection process, wherein the substrate inspection process comprises: determining an optimal focus offset value; irradiating the layered structure with incident light focused based on the optimal focus offset value; capturing an image of the pattern of vertical holes from light reflected from the layered structure as a result of the irradiating of the layered structure; and detecting for a defect in the vertical holes using the captured image of the pattern of vertical holes; wherein the determining of the optimal focus offset value comprises: capturing focus offset images each of a region of the layered structure including top surfaces of the ends of the layers while changing the focal position of the incident light, whereby the focus offset images are captured at different focal positions of the incident light; and calculating the optimal focus offset value using the focus offset images.

22 . The method of claim 21 , wherein the determining of the optimal focus offset value comprises:
selecting regions of the focus offset images as comparison regions, respectively; quantifying the contrast of each of the comparison regions of the focus offset images; determining which of the comparison regions has the greatest contrast; and basing the optimal focus offset value on a focus offset value of the focus offset image whose comparison region has the greatest contrast among the comparison regions of the focus offset images.

23 . The method of claim 22 , wherein the comparison regions of the focus offset images are each of a region of a same one of the top surfaces of the ends of the layers, closest to a vertical position of a defect desired to be detected.

24 . The method of claim 21 , wherein the layers include insulating layers and sacrificial layers alternately and repeatedly stacked on the substrate.

25 . The method of claim 24 , further comprising:
forming vertical insulating layers and vertical pillars in the vertical holes; selectively removing the sacrificial layers to form gate regions; and forming gate electrodes in the gate regions, respectively.

26 . An inspection method for use in quality control of semiconductor devices, comprising:
providing a target for inspection, the target including a substrate and a layered structure on the substrate, the layered structure having a pattern of openings exposed at a top surface of the layered structure and a stepped portion having exposed top surfaces disposed at different levels relative to the substrate determining an optimal focus offset value; imaging the layered structure based on the optimal focus offset value to obtain a representation of the pattern of openings; and analyzing the representation of the pattern of holes to determine whether a defect is present in a region of the layered structure including the pattern of holes, wherein the determining of the optimal focus offset value comprises: irradiating a region of the layered structure including the top surfaces of the stepped portion with incident light focused at a focal position spaced a distance from a top surface of the substrate, incrementally changing the focal position to vary the distance at which the focal position is spaced from the top surface of the substrate, capturing an image of said region of the layered structure at each time the focal position has been incrementally changed, whereby a plurality of focus offset images are acquir

Assignees

• Samsung Electronics Co Ltd

Inventors

• Ahn Jeongho
• Oh Jae-Man
• Lee Seongsil
• Yang Yusin
• Ihm Dongchul
• Cho Hyungsuk

Classifications

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P74/27

  Structural arrangements therefor · CPC title

• H10P74/235

  comprising optical enhancement of defects or not-directly-visible states · CPC title

• H10P72/06 Primary

  Apparatus for monitoring, sorting, marking, testing or measuring · CPC title