Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US-10925170-B2 · Feb 16, 2021 · US
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Patent family 63671844
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 63671844 |
| Family type | — |
| Earliest priority | Mar 31, 2017 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10925170B2 — Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
Representative publication
Best representative member for this family based on priority and filing country.
US10925170B2 — Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device (published Feb 16, 2021)
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