Bonded wafer and method for producing bonded wafer
US-2024379899-A1 · Nov 14, 2024 · US
Semiconductor wafers
Semiconductor wafers · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B32B2457/14 |
| Official title | Semiconductor wafers |
| Display label | Semiconductor wafers |
| Total patents | 1,095 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 112 |
| 2016 | 109 |
| 2017 | 129 |
| 2018 | 138 |
| 2019 | 118 |
| 2020 | 104 |
| 2021 | 106 |
| 2022 | 74 |
| 2023 | 71 |
| 2024 | 67 |
| 2025 | 52 |
| 2026 | 15 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
US-2024208179-A1 · Jun 27, 2024 · US
Underfill sheet, underfill sheet integrated with tape for grinding rear surface, underfill sheet integrated with dicing tape, and method for manufacturing semiconductor device
US-2015380277-A1 · Dec 31, 2015 · US
Method for manufacturing semiconductor device
US-2015380291-A1 · Dec 31, 2015 · US
Method for trasferring a layer
US-2015364364-A1 · Dec 17, 2015 · US
Method for molecular adhesion bonding with compensation for radial misalignment
US-2015348933-A1 · Dec 3, 2015 · US
Supporting member separation method
US-2015325465-A1 · Nov 12, 2015 · US
Method of Forming Wafer-Level Molded Structure for Package Assembly
US-2015318271-A1 · Nov 5, 2015 · US
Adhesive composition, laminate, and stripping method
US-2015299534-A1 · Oct 22, 2015 · US
Planar end effector and method of making a planar end effector
US-2015290815-A1 · Oct 15, 2015 · US
Methods for operating a debonder
US-2015283798-A1 · Oct 8, 2015 · US
Bonded Structure and Production Method Therefor
US-2015279700-A1 · Oct 1, 2015 · US
Semiconductor manufacturing apparatus
US-2015262851-A1 · Sep 17, 2015 · US
Method and apparatus for temporary bonding of ultra thin wafers
US-2015251396-A1 · Sep 10, 2015 · US
Bonding system and bonding method
US-2015251398-A1 · Sep 10, 2015 · US
Devices with thinned wafer
US-2015246809-A1 · Sep 3, 2015 · US
Room-temperature bonding apparatus and room-temperature bonding method
US-2015249026-A1 · Sep 3, 2015 · US
Adhesive bonding composition and method of use
US-2015246521-A1 · Sep 3, 2015 · US
Thermocompression bonding systems and methods of operating the same
US-2015249027-A1 · Sep 3, 2015 · US
Method for molecular adhesion bonding with compensation for radial misalignment
US-9123631-B2 · Sep 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B32B2457/14?
- CPC B32B2457/14 is the Cooperative Patent Classification code for “Semiconductor wafers.”
- How many patents are filed under CPC B32B2457/14 (Semiconductor wafers)?
- Our database includes 1,095 publications tagged with this CPC code.
- Is patent activity under CPC B32B2457/14 growing?
- Publication counts under this code: 67 in 2024 vs 52 in 2025 (latest complete years).