Method for manufacturing display device and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-2018151852-A1
Application number	US-201815880601-A
Country	US
Kind code	A1
Filing date	Jan 26, 2018
Priority date	Feb 28, 2014
Publication date	May 31, 2018
Grant date	—

Abstract

A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.

First claim

What is claimed is:

1 . A method for manufacturing a display device, the method comprising:
forming a first layer over a first substrate; forming an opening in the first layer; forming a second layer over the first layer; forming an electrode over the second layer; forming a third layer over the electrode; forming a display element over the third layer; and irradiating at least part of the electrode with light; peeling the first substrate from the second layer after the step of irradiating the light, wherein the display element is electrically connected to the electrode, and wherein at least a part of the electrode is exposed at the step of peeling the first substrate.

2 . The method according to claim 1 , further comprising a step of exposing a surface of the first layer to an atmosphere containing oxygen before forming the second layer.

3 . The method according to claim 1 , wherein the first layer comprises at least one of tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, ruthenium, rhodium, palladium, osmium, iridium, and silicon.

4 . The method according to claim 1 , wherein the second layer comprises silicon.

5 . The method according to claim 1 , wherein the third layer comprises an organic resin material.

6 . The method according to claim 1 , further comprising a step of connecting the exposed electrode with an external electrode through which a signal is input to the display element.

7 . The method according to claim 6 , wherein the external electrode is a flexible printed circuit.

8 . The method according to claim 1 , further comprising a step of bonding a second substrate on the second layer with an adhesive.

9 . The method according to claim 8 , wherein the second substrate is a flexible substrate.

10 . A method for manufacturing a display device, the method comprising:
forming a first layer over a first substrate; forming a plurality of openings in the first layer; forming a second layer over the first layer; forming an electrode over the second layer; forming a third layer over the electrode; forming a display element over the third layer; irradiating at least part of the electrode with light; and peeling the first substrate from the second layer after the step of irradiating the light, wherein the display element is electrically connected to the electrode, and wherein at least a part of the electrode is exposed at the step of peeling the first substrate.

11 . The method according to claim 10 , further comprising a step of exposing a surface of the first layer to an atmosphere containing oxygen before forming the second layer.

12 . The method according to claim 10 , wherein the first layer comprises at least one of tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, ruthenium, rhodium, palladium, osmium, iridium, and silicon.

13 . The method according to claim 10 , wherein the second layer comprises silicon.

14 . The method according to claim 10 , wherein the third layer comprises an organic resin material.

15 . The method according to claim 10 , further comprising a step of connecting the exposed electrode with an external electrode through which a signal is input to the display element.

16 . The method according to claim 15 , wherein the external electrode is a flexible printed circuit.

17 . The method according to claim 10 , further comprising a step of bonding a second substrate on the second layer with an adhesive.

18 . The method according to claim 17 , wherein the second substrate is a flexible substrate.

Assignees

• Semiconductor Energy Lab

Inventors

• Sakuishi Tatsuya
• Nakamura Daiki
• Chida Akihiro
• Aoyama Tomoya

Classifications

• B32B38/105 Primary

  on edges · CPC title

• B32B2310/0843

  using laser · CPC title

• B32B2457/20

  Displays, e.g. liquid crystal displays, plasma displays · CPC title

• H01L27/1218

  Electricity · mapped topic

• H01L51/56 Primary

  Electricity · mapped topic