Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate

Patent metadata

Field	Value
Publication number	US-2016163579-A1
Application number	US-201514940506-A
Country	US
Kind code	A1
Filing date	Nov 13, 2015
Priority date	Dec 3, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.

First claim

What is claimed is:

1 . A method for manufacturing a laminate, comprising:
forming a step difference by grinding a periphery edge portion of a substrate to have such a size that a surface on an inner side of the step difference can be housed in a cavity of a die; and forming a laminate by laminating the substrate, an adhesive layer, a release layer altered by light absorption, and a support formed of a light transmitting material in this order after the forming of the step difference, wherein in the forming of the laminate, the substrate is laminated such that the surface on the inner side of the step difference of the substrate faces the support.

2 . The method for manufacturing a laminate according to claim 1 , further comprising:
thinning the substrate from a rear side of a facing surface in which the step difference is formed until the step difference is eliminated after the forming of the laminate.

3 . A method for manufacturing a sealed substrate laminate, comprising:
manufacturing a laminate by the method according to claim 2 ; forming a sealed substrate laminate by sealing at least the substrate with a sealing material supplied to a space which formed between the die and the laminate by setting the laminate in the die such that the substrate is housed in the cavity of the die and covering the cavity with the support after the thinning of the substrate; and releasing the sealed substrate laminate from the die after the forming of the sealed substrate laminate.

4 . A method for manufacturing a sealed substrate, comprising:
manufacturing a sealed substrate laminate by the method according to claim 3 ; and separating the support from the sealed substrate laminate by irradiating the release layer with light through the support and altering the release layer after the manufacturing of the sealed substrate laminate.

5 . A sealed substrate laminate comprising:
a laminate that is formed by laminating a substrate, an adhesive layer, a release layer altered by light absorption, and a support formed of a light transmitting material in this order; and a sealing material that seals the substrate, the adhesive layer, and the release layer, wherein a peripheral edge of the sealing material is positioned on the inner side of a peripheral edge of the support.

6 . A sealed substrate manufactured by the method for manufacturing a sealed substrate according to claim 4 .

7 . The method for manufacturing a laminate according to claim 1 , wherein in the laminate forming process, a notched portion formed on the substrate and a notched portion formed on the support are arranged to be overlapped with each other so that the substrate is overlapped with the support.

8 . The sealed substrate laminate according to claim 5 , wherein the shape of the support is a flat circular shape and a notched portion for specifying the direction of the support is formed in the peripheral edge portion of the support.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Nakamura Akihiko
• Nakada Kimihiro

Classifications

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W72/07207

  Temporary substrates, e.g. removable substrates · CPC title

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title