Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
US2018096879A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018096879-A1 |
| Application number | US-201615285894-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 5, 2016 |
| Priority date | Oct 5, 2016 |
| Publication date | Apr 5, 2018 |
| Grant date | — |
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Apparatus for treating a substrate includes a stationary plate assembly including liquid nozzles to direct liquid at an edge of the substrate during treatment. A chuck assembly includes a chuck body arranged below and radially outside of the stationary plate assembly and rotatable relative to the stationary plate assembly. An edge ring is attached to the chuck body and defines a radially inner surface extending in an axial direction above and below a plane including the substrate. The edge ring is located radially outside of a radially outer edge of the substrate along an entire surface of the edge ring. A plurality of pins is movable between a clamping position to engage the radially outer edge of the substrate and an idle position.
Opening claim text (preview).
What is claimed is: 1 . Apparatus for treating a substrate, comprising: a stationary plate assembly including liquid nozzles to direct liquid at an edge of the substrate during treatment; and a chuck assembly including: a chuck body arranged below and radially outside of the stationary plate assembly and rotatable relative to the stationary plate assembly; an edge ring attached to the chuck body and defining a radially inner surface extending in an axial direction above and below a plane including the substrate, wherein the edge ring is located radially outside of a radially outer edge of the substrate along an entire surface of the edge ring; and a plurality of pins that is movable between a clamping position to engage the radially outer edge of the substrate and an idle position. 2 . The apparatus of claim 1 , wherein the plurality of pins is rotatable relative to the chuck body. 3 . The apparatus of claim 1 , wherein the radially inner surface of the edge ring includes a plurality of recesses for receiving at least part of the plurality of pins when the plurality of pins is in the clamping position. 4 . The apparatus of claim 1 , wherein each of the plurality of pins includes a gripping end that is cylindrically-shaped or prism-shaped and wherein a surface of the gripping ends for contacting the substrate is parallel to an axis of rotation of the substrate. 5 . The apparatus of claim 1 , wherein each of the plurality of pins includes a gripping end and wherein the radially inner surface of the edge ring includes a plurality of arcuate recesses for receiving at least part of the gripping ends. 6 . The apparatus of claim 1 , wherein each of the plurality of pins includes a gripping end that is cylindrically-shaped and wherein a gap between the substrate and the radially inner surface of the edge ring is less than or equal to a diameter of the gripping ends. 7 . The apparatus of claim 1 , wherein the stationary plate assembly includes gas nozzles to supply gas in an upward direction towards the substrate to support the substrate at a floating height above the stationary plate assembly during treatment. 8 . The apparatus of claim 1 , wherein a liquid meniscus is created by the liquid nozzles between the substrate and the edge ring during treatment. 9 . The apparatus of claim 1 , wherein a floating height of the substrate above the stationary plate assembly is in a range from 0.2 mm to 0.5 mm. 10 . The apparatus of claim 1 , wherein a distance between the stationary plate assembly and an upper edge of the radially inner surface of the edge ring is in a range from 1.3 mm to 2.5 mm. 11 . The apparatus of claim 1 , wherein a distance between a radially outer edge of the stationary plate assembly and the radially inner surface of the edge ring is in a range from 0.1 mm to 0.7 mm. 12 . The apparatus of claim 1 , wherein a distance between the stationary plate assembly and a lower edge of the radially inner surface of the edge ring is in a range from −0.2 mm to 1.5 mm. 13 . The apparatus of claim 1 , wherein a distance between an upper surface of the stationary plate assembly and a lower edge of the radially inner surface of the edge ring is in a range from 0.5 mm to 2.0 mm. 14 . The apparatus of claim 1 , wherein a distance between an upper surface of the substrate and an upper edge of the radially inner surface of the edge ring is in a range from 0.5 mm to 2.0 mm. 15 . The apparatus of claim 1 , wherein the radially inner surface of the edge ring includes recesses and wherein the radially inner surface defines a cylindrical surface along portions of the radially inner surface excluding the recesses. 16 . The apparatus of claim 1 , wherein the radially inner surface of the edge ring is less than or equal to +/−5° from a line parallel to an axis of rotation of the chuck assembly. 17 . The apparatus of claim 16 , wherein the radially inner surface of the edge ring is less than or equal to +/−10° from a line parallel to an axis of rotation of the chuck assembly within a distance 2.0 mm above an upper surface of the substrate and 2.0 mm below a lower surface of the substrate. 18 . The apparatus of claim 16 , wherein the radially inner surface of the edge ring is concave. 19 . The apparatus of claim 16 , wherein the radially inner surface of the edge ring is convex.
characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title
mainly by radiation · CPC title
mainly by convection · CPC title
using mainly spraying means, e.g. nozzles · CPC title
using vacuum or suction, e.g. Bernoulli chucks · CPC title
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