Susceptor for epitaxial processing and epitaxial reactor including the susceptor

US2024006225A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024006225-A1
Application numberUS-202318327546-A
CountryUS
Kind codeA1
Filing dateJun 1, 2023
Priority dateJun 30, 2022
Publication dateJan 4, 2024
Grant date

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A susceptor for supporting a semiconductor wafer in a heated chamber includes a body that has a front surface, a rear surface, and a central plane between the front and rear surfaces. The susceptor also includes a recess that extends into the body from the front surface to a recess floor and a ledge that circumscribes the recess floor in the recess. The ledge includes a first surface oriented at a first angle relative to a horizontal plane parallel to the central plane, a second surface that extends radially inward from the first surface, the second surface optionally oriented at a second acute angle relative to the horizontal plane, and a third surface that extends between the second surface and the recess floor, the third surface oriented at a third acute angle relative to the horizontal plane. Each of the first, second, and third surfaces extends circumferentially along the ledge.

First claim

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What is claimed is: 1 . A susceptor supporting a semiconductor wafer in a heated chamber, the semiconductor wafer comprising a forward surface, a back surface, and a peripheral edge joining the forward and back surfaces, the susceptor comprising: a body having a front surface, a rear surface opposite the front surface, and a central plane extending between the front surface and the rear surface; a recess extending into the body from the front surface to a recess floor, the rec…

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What does patent US2024006225A1 cover?
A susceptor for supporting a semiconductor wafer in a heated chamber includes a body that has a front surface, a rear surface, and a central plane between the front and rear surfaces. The susceptor also includes a recess that extends into the body from the front surface to a recess floor and a ledge that circumscribes the recess floor in the recess. The ledge includes a first surface oriented a…
Who is the assignee on this patent?
Globalwafers Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/7611. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jan 04 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).