Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
US2024006225A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024006225-A1 |
| Application number | US-202318327546-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 1, 2023 |
| Priority date | Jun 30, 2022 |
| Publication date | Jan 4, 2024 |
| Grant date | — |
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A susceptor for supporting a semiconductor wafer in a heated chamber includes a body that has a front surface, a rear surface, and a central plane between the front and rear surfaces. The susceptor also includes a recess that extends into the body from the front surface to a recess floor and a ledge that circumscribes the recess floor in the recess. The ledge includes a first surface oriented at a first angle relative to a horizontal plane parallel to the central plane, a second surface that extends radially inward from the first surface, the second surface optionally oriented at a second acute angle relative to the horizontal plane, and a third surface that extends between the second surface and the recess floor, the third surface oriented at a third acute angle relative to the horizontal plane. Each of the first, second, and third surfaces extends circumferentially along the ledge.
Opening claim text (preview).
What is claimed is: 1 . A susceptor supporting a semiconductor wafer in a heated chamber, the semiconductor wafer comprising a forward surface, a back surface, and a peripheral edge joining the forward and back surfaces, the susceptor comprising: a body having a front surface, a rear surface opposite the front surface, and a central plane extending between the front surface and the rear surface; a recess extending into the body from the front surface to a recess floor, the rec…
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