Back grinding apparatus and wear amount measuring method using the same
US-2024424637-A1 · Dec 26, 2024 · US
Processing apparatus and processing method of stack
US2017334187A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017334187-A1 |
| Application number | US-201715610890-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 1, 2017 |
| Priority date | Aug 30, 2013 |
| Publication date | Nov 23, 2017 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
First claim
Opening claim text (preview).
1 . A method for manufacturing a semiconductor device comprising: separating a pair of substrates by inserting a wedge-shaped jig into a gap between the pair of substrates, wherein a component including a transistor is provided between the pair of substrates. 2 . The method for manufacturing a semiconductor device according to claim 1 , wherein the wedge-shaped jig is inserted into a corner of the pair of substrates. 3 . The method for manufacturing a semiconductor device according to claim 1 , wherein end portions of the pair of substrates are chamfered. 4 . The method for manufacturing a semiconductor device according to claim 1 , wherein the component further includes an electroluminescent element. 5 . A method for manufacturing a semiconductor device comprising: separating a pair of substrates by inserting a wedge-shaped jig into a gap between the pair of substrates while lifting one of the pair of substrates upward with an adsorption jig, wherein a component including a transistor is provided between the pair of substrates. 6 . The method for manufacturing a semiconductor device according to claim 5 , wherein the wedge-shaped jig is inserted into a corner of the pair of substrates. 7 . The method for manufacturing a semiconductor device according to claim 5 , wherein end portions of the pair of substrates are chamfered. 8 . The method for manufacturing a semiconductor device according to claim 5 , wherein the component further includes an electroluminescent element. 9 . A method for manufacturing a semiconductor device comprising: separating a pair of substrates by inserting a wedge-shaped jig into a gap between the pair of substrates while supplying liquid into the gap from a nozzle, wherein a component including a transistor is provided between the pair of substrates. 10 . The method for manufacturing a semiconductor device according to claim 9 , wherein the wedge-shaped jig is inserted into a corner of the pair of substrates. 11 . The method for manufacturing a semiconductor device according to claim 9 , wherein end portions of the pair of substrates are chamfered. 12 . The method for manufacturing a semiconductor device according to claim 9 , wherein the component further includes an electroluminescent element. 13 . The method for manufacturing a semiconductor device according to claim 9 , wherein the liquid is water.
Assignees
Inventors
Classifications
used during dicing or grinding · CPC title
- H10P72/0428Primary
Apparatus for mechanical treatment or grinding or cutting · CPC title
Vacuum delaminating means [e.g., vacuum chamber, etc.] · CPC title
the cutting blade having a special shape, e.g. a special outline, serrations · CPC title
- B32B43/006Primary
Delaminating · CPC title
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Frequently asked questions
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- What does patent US2017334187A1 cover?
- A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of t…
- Who is the assignee on this patent?
- Semiconductor Energy Lab
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).