Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate

Patent metadata

Field	Value
Publication number	US-2017329220-A1
Application number	US-201515529796-A
Country	US
Kind code	A1
Filing date	Nov 25, 2015
Priority date	Nov 26, 2014
Publication date	Nov 16, 2017
Grant date	—

Abstract

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; an aliphatic compound having two or more functional groups being at least one selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group; and a compound having at least one skeleton selected from the group consisting of an anthracene skeleton, a phenanthrene skeleton, a pyrene skeleton, a perylene skeleton, a carbazole skeleton, a phenothiazine skeleton, a xanthone skeleton, a thioxanthone skeleton, an acridine skeleton, a phenylpyrazoline skeleton, a distyrylbenzene skeleton and a distyrylpyridine skeleton, or a benzophenone compound.

First claim

1 . A photosensitive resin composition comprising:
a component (A): a resin having a phenolic hydroxyl group; a component (B): a photosensitive acid generator; a component (C): a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; a component (D): an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group; and a component (E): at least one selected from the group consisting of a component (E1) and a component (E2), wherein the component (E1) is a compound having at least one skeleton selected from the group consisting of an anthracene skeleton, a phenanthrene skeleton, a pyrene skeleton, a perylene skeleton, a carbazole skeleton, a phenothiazine skeleton, a xanthone skeleton, a thioxanthone skeleton, an acridine skeleton, a phenylpyrazoline skeleton, a distyrylbenzene skeleton and a distyrylpyridine skeleton, and the component (E2) is a benzophenone compound.

2 - 3 . (canceled)

4 . The photosensitive resin composition according to claim 1 , wherein a content of the component (D) is 1 to 70 parts by mass with respect to 100 parts by mass of the component (A).

5 . The photosensitive resin composition according to claim 1 , further comprising a compound having a Si—O bond.

6 . A photosensitive element comprising:
a support; and a photosensitive layer provided on the support, wherein the photosensitive layer comprises the photosensitive resin composition according to claim 1 .

7 . A cured product of the photosensitive resin composition according to claim 1 .

8 . A semiconductor device comprising the cured product of the photosensitive resin composition according to claim 7 .

9 . A method for forming a resist pattern, comprising:
a step of forming a photosensitive layer comprising the photosensitive resin composition according to claim 1 on a substrate; an exposing step of exposing the photosensitive layer in order to form a predetermined pattern; a developing step of developing the photosensitive layer after the exposing step to obtain a resin pattern; and a heat-treating step of heat-treating the resin pattern.

10 . A method for forming a resist pattern, comprising:
a step of disposing the photosensitive layer of the photosensitive element according to claim 6 on a substrate; an exposing step of exposing the photosensitive layer in order to form a predetermined pattern; a developing step of developing the photosensitive layer after the exposing step to obtain a resin pattern; and a heat-treating step of heat-treating the resin pattern.

11 . The method for forming a resist pattern according to claim 9 , further comprising a step of heat-treating the photosensitive layer between the exposing step and the developing step.

12 . A method for producing a circuit substrate, comprising:
a conductor layer forming step of subjecting at least a part of an exposed part of the resin pattern after the heat-treating step in the method for forming a resist pattern according to claim 9 , and at least a part of an exposed part of the substrate to a plating treatment, to form a conductor layer; and a conductor pattern forming step of removing a part of the conductor layer to form a conductor pattern, wherein the circuit substrate includes a resin pattern and a conductor pattern.

13 . The method for producing a circuit substrate according to claim 12 , wherein the conductor layer forming step includes a step of performing electrolytic plating after performing electroless plating, to form the conductor layer.

14 . The method for producing a circuit substrate according to claim 12 , wherein the conductor layer forming step includes a step of performing electrolytic plating after performing sputtering, to form the conductor layer.

15 . The method for producing a circuit substrate according to claim 12 , wherein the conductor pattern forming step includes a step of removing a part of the conductor layer by etching, to form the conductor pattern.

16 . The method for producing a circuit substrate according to claim 12 , wherein the conductor pattern forming step includes a step of removing a part of the conductor layer by polishing, to form the conductor pattern.

17 . The photosensitive resin composition according to claim 1 , wherein the component (E) contains the component (E1).

18 . The photosensitive resin composition according to claim 17 , wherein the component (E1) contains a compound having an anthracene skeleton.

19 . The photosensitive resin composition according to claim 1 , wherein the component (E) contains the component (E2).

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Kato Tetsuya
• Iwashita Kenichi
• Nakamura Akihiro
• Nakano Akio
• Ono Hiroshi

Classifications

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• C08G8/20

  with polyhydric phenols · CPC title

• H01B1/128

  comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes · CPC title

• G03F7/0212 Primary

  characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds · CPC title

• H01L21/02118

  Electricity · mapped topic