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Patent family 56074407

This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.

Patent family metadata
FieldValue
Family ID56074407
Family type
Earliest priorityNov 26, 2014
First filing countryUS
Member publications1
CountriesUS
Representative publicationUS2017329220A1 — Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate

Representative publication

Best representative member for this family based on priority and filing country.

US2017329220A1 — Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate (published Nov 16, 2017)

Member publications

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