Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition

Patent metadata

Field	Value
Publication number	US-11016385-B2
Application number	US-201816224812-A
Country	US
Kind code	B2
Filing date	Dec 19, 2018
Priority date	Aug 21, 2018
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.

First claim

What is claimed is:

1. A photosensitive adhesive composition, comprising:
10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group;
10 parts by weight to 90 parts by weight of a tertiary amine polymer; and
0.5 parts by weight to 10 parts by weight of a photoacid initiator,
wherein a weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000,
wherein the tertiary amine polymer has a structure represented by formula (1)

wherein R 1 and R 2 are respectively a methyl group, an ethyl group, a propyl group, or an isopropyl group, and R 3 is a C1 to C5 alkylene group,
R 4 is

a number n of a repeating unit is an integer between 8 and 132, and * is an end bonded to R 3 .

2. The photosensitive adhesive composition of claim 1 , wherein
the monomer having the vinyl ether functional group is 30 parts by weight to 70 parts by weight, the tertiary amine polymer is 30 parts by weight to 70 parts by weight, and the photoacid initiator is 1 part by weight to 5 parts by weight.

3. The photosensitive adhesive composition of claim 1 , wherein the monomer having the vinyl ether functional group has a structure represented by formula (2) or formula (3)

wherein R5, R6, R7, and R8 are respectively a C1 to C5 alkylene group, n is a positive integer of 1 to 5, and Z is a C3 to C10 saturated or unsaturated cycloalkyl group or a C6 to C10 aromatic ring.

4. The photosensitive adhesive composition of claim 1 , wherein the photoacid initiator is a diazonium salt, a phosphonium salt, a sulfonium salt, an iodonium salt, a sulfonate compound, or a combination of the above.

5. The photosensitive adhesive composition of claim 1 , further comprising a thermally conductive powder.

6. The photosensitive adhesive composition of claim 5 , wherein the thermally conductive powder is 200 parts by weight to 1000 parts by weight.

7. The photosensitive adhesive composition of claim 6 , wherein the thermally conductive powder is a metal oxide, a ceramic, a diamond, a charcoal, boron nitride, aluminum oxide, aluminum nitride, magnesium nitride, zinc oxide, silicon carbide, beryllium oxide, tungsten carbide, or a combination of the above.

8. A photosensitive conductive adhesive composition, comprising:
a conductive powder; and the photosensitive adhesive composition of claim 1 .

9. The photosensitive adhesive composition of claim 8 , wherein the conductive powder is 200 parts by weight to 1000 parts by weight.

10. The photosensitive conductive adhesive composition of claim 8 , wherein the conductive powder is a metal powder, a nano powder, graphite, graphene, carbon black, a carbon nanotube, a conductive polymer, a metal oxide, or a combination of the above.

11. The photosensitive conductive adhesive composition of claim 10 , wherein the nano powder is silver, copper, gold, aluminum, platinum, nickel, palladium, or a combination of the above.

12. The photosensitive conductive adhesive composition of claim 10 , wherein the metal oxide is tin dioxide, aluminum-doped zinc oxide, indium tin oxide, or a combination of the above.

13. The photosensitive adhesive composition of claim 8 , wherein
the monomer having the vinyl ether functional group is 30 parts by weight to 70 parts by weight, the tertiary amine polymer is 30 parts by weight to 70 parts by weight, and the photoacid initiator is 1 part by weight to 5 parts by weight.

14. The photosensitive adhesive composition of claim 8 , wherein the monomer having the vinyl ether functional group has a structure represented by formula (2) or formula (3)

wherein R5, R6, R7, and R8 are respectively a C1 to C5 alkylene group, n is a positive integer of 1 to 5, and Z is a C3 to C10 saturated or unsaturated cycloalkyl group or a C6 to C10 aromatic ring.

15. The photosensitive adhesive composition of claim 8 , wherein the photoacid initiator is a diazonium salt, a phosphonium salt, a sulfonium salt, an iodonium salt, a sulfonate compound, or a combination of the above.

16. An electronic device, comprising:
a first substrate having a first electrode;
a second substrate having a second electrode; and
the photosensitive conductive adhesive composition of claim 8 disposed between the first substrate and the second substrate, and the first electrode and the second electrode are electrically connected via the photosensitive conductive adhesive composition.

Assignees

• Ind Tech Res Inst

Inventors

• Yang Yi-Chi
• Ho Shou-Yi
• Chiou Kuo-Chan

Classifications

• C08K2201/011

  Nanostructured additives · CPC title

• C09J165/04

  Polyxylylenes · CPC title

• C08K3/22

  of metals · CPC title

• G03F7/0212

  characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds · CPC title

• C08K3/38

  Boron-containing compounds · CPC title