Carrier substrate
US-9491871-B2 · Nov 8, 2016 · US
using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/4015 |
| Official title | {using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres} |
| Display label | using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres |
| Total patents | 393 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 36 |
| 2016 | 47 |
| 2017 | 66 |
| 2018 | 37 |
| 2019 | 47 |
| 2020 | 39 |
| 2021 | 31 |
| 2022 | 28 |
| 2023 | 24 |
| 2024 | 19 |
| 2025 | 12 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Selective Deposition Of Thin Film Dielectrics Using Surface Blocking Chemistry
US-2016322213-A1 · Nov 3, 2016 · US
Semiconductor device
US-2016315023-A1 · Oct 27, 2016 · US
Electrical connector with low-stress, reduced-electrical-length contacts
US-9478888-B2 · Oct 25, 2016 · US
Electronic device
US-9474152-B2 · Oct 18, 2016 · US
Method for mounting a component in or on a circuit board, and circuit board
US-9462701-B2 · Oct 4, 2016 · US
Capacitive transparent touch sheet having excellent visibility and durability
US-9448678-B2 · Sep 20, 2016 · US
Biocompatible Bonding Method and Electronics Package Suitable for Implantation
US-2016255720-A1 · Sep 1, 2016 · US
Printed board and image forming apparatus
US-2016249449-A1 · Aug 25, 2016 · US
Electronic component module
US-9414513-B2 · Aug 9, 2016 · US
Lead frame, electronic control device using lead frame, and lead-frame mounting method
US-2016211199-A1 · Jul 21, 2016 · US
Method of attaching electronic module on fabrics by stitching metal foil
US-9398714-B1 · Jul 19, 2016 · US
Pad structure and mounted structure
US-9392703-B2 · Jul 12, 2016 · US
Printed board and image forming apparatus
US-9360814-B2 · Jun 7, 2016 · US
Metal Post Bonding Using Pre-Fabricated Metal Posts
US-2016143157-A1 · May 19, 2016 · US
Display apparatus and circuit board module thereof
US-9307655-B2 · Apr 5, 2016 · US
Mounting jig for semiconductor device
US-2016050764-A1 · Feb 18, 2016 · US
Method for manufacturing a plurality of metal posts
US-9263407-B2 · Feb 16, 2016 · US
Injection molded product and method of manufacturing the same
US-9256334-B2 · Feb 9, 2016 · US
Carrier substrate and manufacturing method thereof
US-9247654-B2 · Jan 26, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/4015?
- CPC H05K3/4015 is the Cooperative Patent Classification code for “using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres.”
- How many patents are filed under CPC H05K3/4015 (using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres)?
- Our database includes 393 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/4015 growing?
- Publication counts under this code: 19 in 2024 vs 12 in 2025 (latest complete years).