Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern

Patent metadata

Field	Value
Publication number	US-2016246174-A1
Application number	US-201415025796-A
Country	US
Kind code	A1
Filing date	Sep 29, 2014
Priority date	Sep 30, 2013
Publication date	Aug 25, 2016
Grant date	—

Abstract

A photosensitive resin composition comprises: a component (A): a resin having a phenolic hydroxyl group; a component (B): a compound having a methylol group or an alkoxyalkyl group; a component (C): an aliphatic compound having two or more functional groups, the functional groups being one or more types selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; and a component (D): a photosensitive acid generator.

First claim

1 . A photosensitive resin composition comprising:
a component (A): a resin having a phenolic hydroxyl group; a component (B): a compound having a methylol group or an alkoxyalkyl group; a component (C): an aliphatic compound having two or more functional groups, the functional groups being one or more groups selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; and a component (D): a photosensitive acid generator.

2 . The photosensitive resin composition according to claim 1 , wherein the component (B) comprises a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and having a methylol group or an alkoxyalkyl group.

3 . The photosensitive resin composition according to claim 1 , wherein the content of the component (C) is 20 to 70 parts by mass relative to 100 parts by mass of the component (A).

4 . The photosensitive resin composition according to claim 1 , wherein the component (C) has three or more of the functional groups.

5 . A photosensitive element comprising a supporting material and a photosensitive layer formed on the supporting material,
wherein the photosensitive layer comprises the photosensitive resin composition according to claim 1 .

6 . A cured product of the photosensitive resin composition according to claim 1 .

7 . A semiconductor device comprising the cured product of the photosensitive resin composition according to claim 6 as a surface protective film or an interlayer insulating film.

8 . A method for forming a resist pattern, comprising:
a step of applying the photosensitive resin composition according to claim 1 onto a substrate and drying the applied photosensitive resin composition so as to form a photosensitive layer; a step of exposing the photosensitive layer to an active ray in order to form a predetermined pattern and performing a heat-treatment after exposure; and a step of developing the photosensitive layer after the heat-treatment and heat-treating the obtained resin pattern.

9 . A method for forming a resist pattern, comprising:
a step of forming the photosensitive layer of the photosensitive element according to claim 5 on a substrate; a step of exposing the photosensitive layer to an active ray in order to form a predetermined pattern and performing a heat-treatment after the exposure; and a step of developing the photosensitive layer after the heat-treatment and heat-treating the obtained resin pattern.

10 . The photosensitive resin composition according to claim 2 , wherein the content of the component (C) is 20 to 70 parts by mass relative to 100 parts by mass of the component (A).

11 . The photosensitive resin composition according to claim 2 , wherein the component (C) has three or more of the functional groups.

12 . The photosensitive resin composition according to claim 3 , wherein the component (C) has three or more of the functional groups.

13 . A photosensitive element comprising a supporting material and a photosensitive layer formed on the supporting material,
wherein the photosensitive layer comprises the photosensitive resin composition according to claim 2 .

14 . A photosensitive element comprising a supporting material and a photosensitive layer formed on the supporting material,
wherein the photosensitive layer comprises the photosensitive resin composition according to claim 3 .

15 . A photosensitive element comprising a supporting material and a photosensitive layer formed on the supporting material,
wherein the photosensitive layer comprises the photosensitive resin composition according to claim 4 .

16 . A cured product of the photosensitive resin composition according to claim 2 .

17 . A cured product of the photosensitive resin composition according to claim 3 .

18 . A cured product of the photosensitive resin composition according to claim 4 .

19 . A semiconductor device comprising the cured product of the photosensitive resin composition according to claim 17 as a surface protective film or an interlayer insulating film.

20 . A semiconductor device comprising the cured product of the photosensitive resin composition according to claim 18 as a surface protective film or an interlayer insulating film.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Iwashita Kenichi
• Kato Tetsuya
• Ebihara Masahiko

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• G03F7/0382

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title

• G03F7/038 Primary

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• G03F7/168

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title