Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment

Patent metadata

Field	Value
Publication number	US-2017260639-A1
Application number	US-201715452062-A
Country	US
Kind code	A1
Filing date	Mar 7, 2017
Priority date	Mar 11, 2016
Publication date	Sep 14, 2017
Grant date	—

Abstract

The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.

First claim

What is claimed is:

1 . A method of depositing a material on a substrate, comprising:
positioning an aluminum substrate in an electroplating bath, the electroplating bath comprising a non-aqueous solvent and a deposition precursor; depositing a coating on the aluminum substrate, the coating comprising aluminum or aluminum oxide; removing excess plating solution form the aluminum substrate; and post-treating the aluminum substrate having the coating thereon.

2 . The method of claim 1 , wherein the aluminum substrate comprises Al6061 or Al6063 alloy.

3 . The method of claim 1 , wherein the deposition precursor comprises AlCl 3 or Al(NO 3 ) 3 .

4 . The method of claim 3 , wherein the electroplating bath comprises the non-aqueous solvent and a second solvent in a ratio from 1:2 to 1:5.

5 . The method of claim 3 , wherein the deposition precursor has a concentration within a range of about 0.1M to about 1M.

6 . The method of claim 3 , wherein the deposition precursor has a concentration within a range of about 0.5M to about 1M.

7 . The method of claim 1 , wherein the electroplating bath further comprises potassium nitrate, sodium fluoride, or sodium acetate.

8 . The method of claim 1 , wherein the depositing a coating comprises pulsing a current on and off.

9 . The method of claim 8 , wherein the coating has a thickness of about 3 nanometers to about 8 micrometers.

10 . The method of claim 9 , wherein the coating has a thickness of about 10 nanometers to about 500 nanometers.

11 . The method of claim 1 , wherein the post treatment comprises thermally treating the coating.

12 . The method of claim 1 , wherein the post treatment comprises exposing the coating to am oxidizing agent to oxidize the coating.

13 . The method of claim 1 , wherein the depositing the coating comprises applying a bias voltage within a range of about 1 volt to about 300 volts.

14 . The method of claim 13 , wherein the post-treatment comprises exposing the aluminum substrate to an ozone plasma.

15 . The method of claim 1 , wherein the post-treatment process oxidizes about 200 nanometers or less of the coating.

16 . A method of depositing a material on a substrate, comprising:
positioning an aluminum substrate having one or more plenums formed therein in an electroplating bath, the electroplating bath comprising a non-aqueous solvent and a deposition precursor, the deposition precursor comprising AlCl 3 , Al(NO 3 ) 3 , or an aluminum alkyl; depositing a coating on the aluminum substrate, the coating comprising aluminum or aluminum oxide; removing excess plating solution from the aluminum substrate, wherein the removing comprises washing and drying the aluminum substrate; and post-treating the aluminum substrate having the coating thereon.

17 . The method of claim 16 , wherein the post-treating comprises exposing the aluminum substrate to an ozone plasma.

18 . The method of claim 16 , wherein the post-treating comprises oxidizing the coating.

19 . A method of depositing a material on a substrate, comprising:
positioning an aluminum substrate having one or more plenums formed therein in an electroplating bath, the electroplating bath comprising a non-aqueous solvent, a deposition precursor, and one or more additives selected from the group consisting of potassium nitrate, sodium fluoride, sodium acetate, sulphonamide, and tetrabutyl ammonium hexafluorophosphate; depositing a coating on the aluminum substrate, the coating comprising aluminum or aluminum oxide; removing excess plating solution form the aluminum substrate; and post-treating the aluminum substrate having the coating thereon.

20 . The method of claim 19 , wherein the deposition precursor comprising AlCl 3 or Al(NO 3 ) 3 .

Assignees

• Applied Materials Inc

Inventors

• Pareek Yogita
• Kalita Laksheswar
• Bajaj Geetika
• Papke Kevin A
• Kadam Ankur
• Thakur Bipin
• Lin Yixing
• Lubomirsky Dmitry
• Goradia Prerna A

Classifications

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• C25D11/04

  of aluminium or alloys based thereon · CPC title

• C25D3/44 Primary

  Aluminium · CPC title

• C25D5/022

  using masking means · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title