Plasma processing apparatus, method of operating plasma processing apparatus, and power supply device

Patent metadata

Field	Value
Publication number	US-2017110297-A1
Application number	US-201515309399-A
Country	US
Kind code	A1
Filing date	Jun 1, 2015
Priority date	Jun 11, 2014
Publication date	Apr 20, 2017
Grant date	—

Abstract

A plasma processing apparatus according to an embodiment includes a processing container, a mounting table, a plurality of heaters, and a power supply device. The mounting table is provided in the processing container. The plurality of heaters are provided in the mounting table. The power supply device supplies electric power to the plurality of heaters. The power supply device includes a plurality of transformers and a plurality of zero-cross control type solid state relays (SSRs). The plurality of transformers are configured to step down a voltage from an alternating-current power source. Each of the plurality of transformers includes a primary coil and a secondary coil. The primary coil is connected to the alternating-current power source. Each of the plurality of SSRs is provided between one corresponding heater among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.

First claim

1 . A plasma processing apparatus for performing plasma processing on a workpiece, comprising:
a processing container; a mounting table provided in the processing container; a plurality of heaters which are provided in the mounting table; and a power supply device which supplies electric power to the plurality of heaters, wherein the power supply device includes: a plurality of transformers configured to step down a voltage from an alternating-current power source, each of the plurality of transformers including a primary coil connected to the alternating-current power source and a secondary coil; and a plurality of zero-cross control type solid state relays each of which is provided between one corresponding heater among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.

2 . The plasma processing apparatus according to claim 1 , further comprising:
a plurality of first wires which individually connect first terminals of the plurality of heaters and the plurality of zero-cross control type solid state relays; and a plurality of second wires each of which commonly connects second terminals of two or more corresponding heaters among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.

3 . The plasma processing apparatus according to claim 2 ,
wherein two or more heaters connected to a common second wire among the plurality of second wires have a same resistance value as each other.

4 . The plasma processing apparatus according to claim 1 ,
wherein the power supply device further includes a plurality of switchers which change transformation ratios of the plurality of transformers.

5 . The plasma processing apparatus according to claim 4 , further comprising:
a controller which controls the plurality of switchers, wherein the controller performs a first control which controls the plurality of switchers to set the transformation ratios of the plurality of transformers, and a second control which controls the plurality of switchers to set the transformation ratios of the plurality of transformers to transformation ratios which are higher than the transformation ratios of the plurality of transformers set in the first control.

6 . A method for operating the plasma processing apparatus according to claim 4 , comprising:
a first step of controlling the plurality of switchers to set the transformation ratios of the plurality of transformers; and a second step of controlling the plurality of switchers to set the transformation ratios of the plurality of transformers to transformation ratios which are higher than the transformation ratios of the plurality of transformers set in the first step.

7 . A power supply device for supplying electric power to a plurality of heaters which are provided in a mounting table of a plasma processing apparatus, comprising:
a plurality of transformers configured to step down a voltage from an alternating-current power source, each of the plurality of transformers including a primary coil connected to the alternating-current power source and a secondary coil; and a plurality of zero-cross control type solid state relays each of which is provided between one corresponding heater among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.

8 . The power supply device according to claim 7 , further comprising:
a plurality of switchers which change transformation ratios of the plurality of transformers.

Assignees

• Tokyo Electron Ltd

Inventors

• TERUUCHI Satoru

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P72/72

  using electrostatic chucks · CPC title