Heat treatment apparatus and temperature control method

Patent metadata

Field	Value
Publication number	US-2016379897-A1
Application number	US-201615191599-A
Country	US
Kind code	A1
Filing date	Jun 24, 2016
Priority date	Jun 29, 2015
Publication date	Dec 29, 2016
Grant date	—

Abstract

There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.

First claim

What is claimed is:

1 . A heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table, the heat treatment apparatus comprising:
a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.

2 . The heat treatment apparatus of claim 1 , wherein the temperature control part stores a correlation between the first measurement value and the second measurement value into a storage part, and controls the heating part based on the correlation stored in the storage part.

3 . The heat treatment apparatus of claim 2 , wherein the temperature control part controls the heating part such that the temperature measured by the second temperature measuring part meets a temperature condition applied when performing the predetermined film forming process, and subsequently, stores the correlation between the first measurement value and the second measurement value into the storage part.

4 . The heat treatment apparatus of claim 2 , wherein the temperature control part changes the temperature measured by the second temperature measuring part to meet a plurality of temperature conditions applied when performing the predetermined film forming process, and stores a correlation between the first measurement value and the second measurement value under each of the plurality of temperature conditions into the storage part.

5 . The heat treatment apparatus of claim 2 , wherein the second temperature measuring part detects an infrared ray radiated from a surface of the substrate to measure the temperature of the substrate.

6 . The heat treatment apparatus of claim 1 , wherein the second temperature measuring part measures temperatures in a plurality of regions defined along a diameter direction of the rotary table.

7 . A temperature control method used in a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed inside a processing vessel and heating the substrate by a heating part while rotating the rotary table, the temperature control method comprising:
mounting the substrate on the rotary table; measuring, by a first temperature measuring part of a contact-type, a temperature of the heating part; measuring, by a second temperature measuring part of a non-contact type, a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and controlling the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.

Assignees

• Tokyo Electron Ltd

Inventors

• Obara Kazuteru
• Yoshii Koji
• Wada Yuki
• Kikuchi Hitoshi

Classifications

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/6339

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title