Aluminum plating solution, aluminum film, resin structure, porous aluminum object, and porous aluminum object manufacturing method

Patent metadata

Field	Value
Publication number	US-2016369418-A1
Application number	US-201514901217-A
Country	US
Kind code	A1
Filing date	Jan 19, 2015
Priority date	Jan 27, 2014
Publication date	Dec 22, 2016
Grant date	—

Abstract

Provided is an aluminum plating solution that has a wide current density range in which aluminum plating can be performed and that has a low solution resistance. The aluminum plating solution contains an aluminum halide, at least one selected from the group consisting of an alkylimidazolium halide, an alkylpyridinium halide, and a urea compound, and an ammonium salt represented by the general formula (1) below. A concentration of the ammonium salt is 1 g/L or more and 45 g/L or less.
NR 4 + .X −   General formula (1)

In the general formula, R each represent a hydrogen atom or an alkyl group which may have a side chain and which has 15 or less carbon atoms, X represents a halogen atom, and R may be the same or different from each other.

First claim

1 . An aluminum plating solution comprising:
an aluminum halide; at least one selected from the group consisting of an alkylimidazolium halide, an alkylpyridinium halide, and a urea compound; and an ammonium salt represented by a general formula (1), wherein a concentration of the ammonium salt is 1 g/L or more and 45 g/L or less:
NR 4 + .X −   General formula (1)

where, in the general formula, R each represent a hydrogen atom or an alkyl group which may have a side chain and which has 15 or less carbon atoms, X represents a halogen atom, and R may be the same or different from each other.

2 . The aluminum plating solution according to claim 1 , wherein the ammonium salt is a dimethylamine hydrochloride or a tetramethylammonium chloride, or a mixture of the dimethylamine hydrochloride and the tetramethylammonium chloride.

3 . The aluminum plating solution according to claim 1 , wherein the alkylimidazolium halide is 1-ethyl-3-methylimidazolium chloride (EMIC).

4 . An aluminum film obtained by using the aluminum plating solution according to claim 1 .

5 . A resin structure comprising a resin molded body having a three-dimensional network structure and subjected to a conductive treatment; and an aluminum film disposed on a surface of a skeleton of the resin molded body, the aluminum film being obtained by using the aluminum plating solution according to claim 1 .

6 . A porous aluminum object obtained by removing a resin from the resin structure according to claim 5 .

7 . A porous aluminum object manufacturing method comprising:
a step of performing a conductive treatment on a surface of a skeleton of a resin molded body having a three-dimensional network structure; a step of electrodepositing an aluminum film, using the aluminum plating solution according to claim 1 , on the surface of the skeleton of the resin molded body subjected to the conductive treatment to form a resin structure; and a step of removing a resin from the resin structure.

Assignees

• Sumitomo Electric Industries

Inventors

• Goto Kengo
• Hosoe Akihisa
• Nishimura Junichi
• Okuno Kazuki
• Kimura Koutarou
• Sakaida Hideaki
• Motomura Junichi

Classifications

• C25D1/003

  3D structures, e.g. superposed patterned layers · CPC title

• C25D3/44 Primary

  Aluminium · CPC title

• C25D1/08 Primary

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title

• C25D3/665 Primary

  from ionic liquids · CPC title

• C25D5/56

  of plastics · CPC title